Slide 1: Scaling Silicon Photonics Platforms: Enabling Foundry PDKs and Ecosystems for 400G and Beyond
ECOC 2026 Scaling Silicon Photonics Platforms: Enabling Foundry PDKs and Ecosystems for 400G and Beyond Robert Blum, SVP, Sales & Marketing September 22, 2026
Slide 2: Forward Looking Statements
Forward Looking Statements This slide presentation contains “forward-looking statements” and “forward-looking information” within the meaning of the Private Securities Litigation Reform Act of 1995. This information and these statements, which can be identified by the fact that they do not relate st
Slide 3: The Challenge of Powering AI: Density, Power, Reliability
The Challenge of Powering AI: Density, Power, Reliability Explosive growth in AI connectivity requires advanced optical modulators: ▪ Denser Integration ▪ Higher Bandwidth ▪ Reduced Driving Voltage ▪ Reduced Insertion Loss ▪ High Reliability Scale Out Domain Possible solutions include 1 Inorganic EO
Slide 4: Lightwave Logic at a Glance
Lightwave Logic at a Glance Leveraging proprietary electro-optic polymers to enable high-speed optical modulators for AI scaling and data communications 69 Granted Patents Englewood, CO LWLG 1997 ~50 >$100M $96M and 99 Applications Global HQ NASDAQ Listed Founded Employees1 Pending R&D Investment Ca
Slide 5: Perkinamine: Unlocking the Power of Silicon Photonics with EO Polymers
Unlocking the Power of Silicon Photonics with EO Polymers Perkinamine® The Fastest Way to Convert Electrical Signals to Optical Signals AI infrastructure depends on high-bandwidth optical connectivity Silicon photonics enables optical connections at CMOS scale, but performance is limited Lightwave L
Slide 6: Silicon Photonics is Winning
Silicon Photonics is Winning Silicon photonics is winning integration platform battle for hyperscale and AI networking Total Optical Transceiver Market 1 (by technology) Optical transceiver market expected to grow $70.4B to $70 billion by 2030 (22% CAGR ‘25-’30) SiPho expected to be dominant technol
Slide 7: Competitively Advantaged Material
Competitively Advantaged Material LWLG EO polymers have inherently high performance and are fully Si-foundry compatible Thin Film Lithium Silicon Organic Silicon Photonics Niobate Hybrids (SiPh) (TFLN) (SiPh + EOP) Mach-Zehnder Modulator Type Ring MZ MZ or Ring (MZ) Speed Power Consumption Size Cost
Slide 8: EO Polymer SOH MZI Slot Modulator Structure
EO Polymer SOH MZI Slot Modulator Structure Polymer-coated regions MMI Splitter L Electrical signal Optical signal The SOH (Silicon-Organic Hybrid) Advantage: ▪ Combines the maturity of Silicon Photonics with the strong EO response of polymers ▪ Offers significant promise for scalable deployment in
Slide 9: Simplified BEOL Process Flow
Simplified BEOL Process Flow As received after Front end 1. Underlayer deposition 3. Upper layer deposition processing 2. EO polymer deposition 7. Encapsulation layer patterning 6. Encapsulation layer deposition 4. EO polymer patterning and etching 5. Reticle or wafer level poling Layer Legend Si Si
Slide 10: Silicon Slot Waveguide Cross Sections
Silicon Slot Waveguide Cross Sections Collaborating with foundries to produce consistent slot waveguides for optimal performance 100 µm 500 nm 100 nm Clean, sharp and smooth Si slots for polymer deposition and encapsulation © Lightwave Logic 2026. All Rights Reserved. 10
Slide 11: Reliability Performance Exceeds Industry Standard
Reliability Performance Exceeds Industry Standard Material Reliability Challenges Addressed Device Reliability In Progress Temperature = 85 °C Humidity = 85%rh Data demonstrates LWLG EO polymer is Loss of Poling very stable at high temperatures (>>100yr projected lifetime at 85°C) Chromophore Data s
Slide 12: 45C – 105C Temperature Cycling Test
45C – 105C Temperature Cycling Test © Lightwave Logic 2026. All Rights Reserved. 12
Slide 13: Business Model and Foundry PDKs
Business Model and Foundry PDKs Business Model ▪ EO Polymer Material Sales & IP Licensing/ Royalties for Polymer PDK ▪ Customers can co-design/ co-optimize using LWLG reference design Various Foundries are Implementing LWLG Reference Designs Publicly announced: Reference design © Lightwave Logic 202
Slide 14: MZI SOH Modulator: PDK Building Blocks
MZI SOH Modulator: PDK Building Blocks Encapsulating Layer Phase Shifter (unique to SOH) Mode Converter (unique to SOH) 1. Ridge WG to Ridge-Slot WG 2. Ridge Slot WG to Rib-Slot WG Power Splitter (common w/ SiPh) (MMI, Y-Junction, Directional Coupler, etc.) Grating / Edge Couplers (common w/ SiPh) ©
Slide 15: Photonic Mode Conversion: Optimization Targets
Photonic Mode Conversion: Optimization Targets (a) Ridge WG Optimization targets for the transitions from (a) Ridge WG to (b) Ridge-Slot WG to (c) Rib-Slot WG Maximize the power in the slot ▪ Higher power in the slot results in lower radiation (b) Ridge-Slot WG and scattering from fab non-ideal Si r
Slide 16: Phase Modulation Section Design: Trade-offs
Phase Modulation Section Design: Trade-off’s Not to Scale Metal Oxide Encapsulation Layer Oxide Metal Via Via Rail Slot Rail EOP Si Slab n++ doping n+ doping n doping n doping n+ doping n++ doping Si Slab Box 1 𝜆 𝑆𝑙𝑜𝑡 𝑤 𝑉𝜋 𝐿 = Optical Loss 𝑓 𝐵𝑊 = 1/(2𝜋 RC) 2 𝑛𝑒𝑜𝑝3 𝑟33𝑒𝑜𝑝 𝛤…
Slide 17: RF Performance Optimization: Slots, Slabs and Doping
RF Performance Optimization: Slots, Slabs and Doping EOBW RF Sims for EO Polymer SOH devices w/ optimized: Slot Widths, Slab Thickness, Doping Profile and Concentrations Certain foundries have optimum geometries and doping profile capabilities available in their PDK today. Others are running short l
Slide 18: Initial 240 Gbps Eye from New Foundry Tapeout
Initial 240 Gbps Eye from New Foundry Tapeout Raw Electrical Eye Equalized Electrical Eye Output device optical eye Direct BERT data output signal TDECQ = 2.35 dB TDECQ = 2.87 dB (electrical eye with no device) 240 Gbps, 0.9 V amplitude ▪ 9-tap equalization ▪ 0.9V drive voltage with no pre-distortio
Slide 19: >400 Gb/s with EO Polymer based Plasmonic Modulators
>400 Gb/s with EO Polymer based Plasmonic Modulators A.H.: Y. Horst et al., Optica, vol12(3):325-8 (2025) Polariton packaged products with Lightwave Logic EO polymer engine © Lightwave Logic 2026. All Rights Reserved. 19
Slide 20: Conclusion
Conclusion Summary ▪ LWLG has developed EO polymer, BEOL and SOH modulator device technology ▪ 200G designs have shown high bandwidth and low drive voltage ▪ EO Polymer material and encapsulation achieved Telcordia reliability performance at thin film level. Additional reliability studies underway f
Slide 21: Thank you!
Thank you! robert.blum@lightwavelogic.com www.lightwavelogic.com