Slide 1: ASML 2008 Second Quarter Results
ASML 2008 Second Quarter Results Immersion technology growth continues amid macro-economic pressure July 16, 2008
Slide 2: Safe Harbor
Safe Harbor "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average sales pric
Slide 3: ASML - the world's largest supplier of lithography equipment
ASML - the world's largest supplier of lithography equipment Source: Semi & ASML Leadership in immersion for volume chip manufacturing ASML Canon Nikon East 65 11 24 West North Canon 11% ASML 65% Nikon 24% ASML AMAT TELL KLA East 22 32 25 11 10 West North KLA Tencor ASML Tokyo Electron Lam Research
Slide 4: Agenda
Agenda Market Achievements Business summary Outlook
Slide 5: & ASML
Gy & ASML
Slide 6: Macro and sector trends
Macro and sector trends Global economic environment not improving Logic/Foundry customer factory utilization rates remain high, especially for 300mm. Logic chip ASPs are rising but these customers are tightly controlling capex DRAM installed litho capacity is more or less stable. Customers mainly or
Slide 7: Achievements
Achievements
Slide 8: Q2 achievements
Q2 achievements Strong immersion performance with 16 immersion tools shipped in Q2 Increased market share in Japan Announced new high-productivity immersion system TWINSCAN(tm) XT:1950i Accomplished breakthroughs in EUV
Slide 9: Immersion is key in 2008
Immersion is key in 2008 Shipped 30 immersion systems YTD Booked 20 immersion systems in Q2 Current backlog includes 27 immersion systems On track to nearly double immersion revenue in 2008 compared with 2007
Slide 10: ASML immersion systems operating at different customers
More than 100 ASML immersion systems operating at 20 different customers; significant gains in H1 2008 2004 2005 2006 2007 H1 2008 USA 1 4 12 21 27 Korea 2 7 19 32 Taiwan 1 3 5 8 8 Europe 1 2 6 9 10 Japan 4 14 22 Other 1 3 Cumulative ASML immersion systems 27 33 8 11 22 3 21 19 8 9 14 1 12 7 5 6 4
Slide 11: New immersion product XT:1950i to ship Q1 2009
New immersion product XT:1950i to ship Q1 2009 Key benefits Manufacturing performance increased by 25% over previous high-end system: smaller features (38 nm) creates 10% more wafer area, which results in the most powerful chips to date and more chips per wafer higher throughput speed further increa
Slide 12: Improved overlay performance options
Improved overlay performance options: DCO ^ 3.5 nm SMO ^ 4.0 nm MMO ^ 7.0 nm iClean option boosts system cleanliness and reliability Best-in-class immersion productivity (PEP & TOP options): 148 wph (300 mm) 125 x 16x32 x 30 mJ/cm2 Faster chuck swap Faster measure cycle Advanced lens control means i
Slide 13: Market share Japan
Market share Japan Technology drives ASML product acceptance Reinforced presence in Japanese memory market, as measured by unit volume shipped to Japan ASML KrF is showing clear advantage for CCD CMOS image sensor application ASML immersion systems selected by a Japanese consumer chip manufacturer -
Slide 14: Progress on EUV
Progress on EUV Productivity of EUV Alpha Demo tool is reaching target First functional SRAM device has been fabricated using the EUV Alpha Demo tool Light source suppliers are confirming roadmaps enabling system performance beyond 100 wph, needed for volume manufacturing tools (see next slide)
Slide 15: EUV: Energy/day planned to improve 100x during 2008
EUV: Energy/day planned to improve 100x during 2008 at multiple light source suppliers 0.0001 0.001 0.01 0.1 1 10 100 1000 10000 100000 Q3/07 Q4/07 Q1/08 Q2/08 Q3/08 Q4/08 Q1/09 Q2/09 Supplier A Supplier B Supplier C kJ/day Supplier A Supplier B Supplier C Avg power [W] Supplier A Supplier B Supplie
Slide 16: Business summary
Business summary sow & ASML
Slide 17: Solid Q2 results
Solid Q2 results Net sales of &128; 844 million Gross Margin of 40%, Operating margin of 18% Cash generation from Operations &128; 130 million Shipped 16 immersion tools Booked 33 systems, valued at &128; 632 Backlog at &128; 1,106 million, 59 systems Record average selling price for new shipped sys
Slide 18: Decreased corporate tax rate in future
Decreased corporate tax rate in future Due to new tax law, income attributable to intangible assets (patents) is effectively taxed at a lower rate in the Netherlands Going forward this will result in a structurally lower effective corporate tax rate this year and beyond, estimated to be 20% on a nor
Slide 19: Quarterly net sales 2003-2008
2003 2004 2005 2006 2007* 2008 Q1 318 453 685 629 949 919 Q2 329 616 763 942 930 844 Q3 370 611 533 958 934 Q4 526 785 548 1068 955 Total net sales M&128; 1,543 2,465 2,529 3,597 3,768 * 2007 numbers are adjusted retrospectively with respect to the change in accounting policy. Numbers have been roun
Slide 20: Net system sales breakdown in value: Q2 2008
Net system sales breakdown in value: Q2 2008 Memory Foundry IDM R&D East 68 15 17 West North End-use Foundry 15% Memory 68% IDM 17% Numbers have been rounded for readers' convenience Technology KrF ArF dry ArF immersion I line East 5 26 65 4 West North KrF 5% i-Line 4% ArF immersion 65% ArF dry 26%
Slide 21: Consolidated statement of operations
Numbers have been rounded for readers' convenience. Consolidated statement of operations M&128;
Slide 22: Key financial trends 2007 - 2008
Key financial trends 2007 - 2008 Consolidated statement of operations M&128; * 2007 numbers are adjusted retrospectively with respect to the change in accounting policy. Numbers have been rounded for readers' convenience.
Slide 23: Cash flow
Cash flow M&128; Numbers have been rounded for readers' convenience.
Slide 24: Balance sheet as of June 29th, 2008
Balance sheet as of June 29th, 2008 M&128; Numbers have been rounded for readers' convenience.
Slide 25: Backlog as of June 29th, 2008
79% of backlog or &128; 875 million system sales carry Q3 + Q4 shipment dates Q2 net bookings of 33 systems with a value of &128; 632 million including 29 new tools with an ASP of &128; 21.3 million Note: Due to possible customer changes in delivery schedules and to cancellation of orders, our backl
Slide 26: Backlog: value and litho units
Backlog: value and litho units Backlog Jan 03 39541 Jul 03 Oct 03 Jan 04 Apr 04 Jul 04 Oct 04 Jan 05 Apr 05 Jul 05 Oct 05 Jan 06 Apr 06 Jul 06 Oct 06 Jan 07 Apr 07 Jul 07 Oct 07 Jan 08 Apr 08 Jul 08 Backlog value 1030 870 678 859 993 1357 1800 2053 1691 1377 987 1245 1434 1596 1830 2126 2146 2163 17
Slide 27: Backlog lithography in value per June 29th, 2008
Taiwan Europe USA Korea Other Japan China 5 15 14 25 5 27 9 memory IDM Foundry 65 27 8 0 0 0 immersion KrF 1-line ArF dry 68 10 2 20 Backlog lithography in value per June 29th, 2008 Total value M&128; 1,106 Technology i-Line 2% ArF immersion 68% KrF 10% ArF dry 20% Region USA 14% Taiwan 5% Korea 25%
Slide 28: Outlook
Outlook
Slide 29: ASML's business model in current environment
ASML's business model in current environment Our gross margin target at &128; 900 million of quarterly sales is approx. 40% Gross margin is impacted by lower coverage of fixed cost at reduced sales volumes Price pressures will be dealt with through accelerated cost reductions (Manufacturing and SG&A
Slide 30: Q3 2008 outlook
Q3 2008 outlook ASML expects to ship 37 systems ASP for new + used systems expected to be &128; 15.6 million Gross margin approximately 38% R&D is expected at &128; 130 million net of credit SG&A is expected to decrease to &128; 52 million
Slide 31: Outlook
Outlook As anticipated, our Q2 bookings increased to 33 systems versus 26 in Q1 with a high average selling price of &128; 19.2 million. Although, this level of orders is in line with our earlier expectation of a full year 2008 net sales decrease of about 10% versus 2007, the current macro-economic
Slide 32: Outlook continued
Outlook continued We expect the 2009 lithography business to be supported by several positive trends. The DRAM ramp-up of 55 nm, the healthy revenue growth at our foundry customers - in particular on leading edge processes - and the transition to double patterning lithography by flash memory leaders
Slide 33: Commitment
Commitment