Slide 1: Sensing Reimagined: Large-Wafer Heterogeneously Integrated InGaAs Photodetector Sensors
Sen s i ng Rei ma g i n e d TM L a rge - W a fer Het erog e neously In t egr a t e d InG a As Pho t ode t ec tor Sensors Matthew Dummer , Jonathan Klamkin, Bei Shi, Bowen Song, Simone S. Brunelli, Michael McGivney, Douglas Oakley, Daniel Renner P a per 1 2 88 0 - 18 J an u a r y 30, 2 0 24 © Aelu m
Slide 2: Outline
Outline © Aelu m a , Inc. All R i g ht s R e serve d . ● I ntrodu c tion to Aeluma ● Background on InGaAs detectors and scaling limitations ● Aeluma’s scalable large - diameter wafer platform ● D e te ct o r array p e rf o rma nce re s ults ● C o mparison to o ther de te ct o r te c h nologi e s ● S
Slide 3: At a Glance
© Aelu m a , Inc. All R i g ht s R e serve d . At a Glance Aeluma, Inc. (O T C Q B : AL M U) A transformative semiconductor chip company High P e rf o rma nce S e mic o nduct o rs that Scale Headquarters : Goleta/Santa Barbara, California Ma rk e t s : Au t omot i v e LiDAR, Mob i l e, AR/VR, Commun
Slide 4: Background on InGaAs Detectors
Background on InGaAs Detectors High Performance Detectors for Active and Passive Imaging © Aelu m a , Inc. All R i g ht s R e serve d . 4 InGaAs: Indium Gallium Arsenide; LiDAR: Light detection and ranging; FPA: Focal plane array. Note: Outcomes cannot be guaranteed. Sources of images: https://www.f
Slide 5: The Aeluma Approach to Photonics Manufacturing
The Aeluma Approach to Photonics Manufacturing High Performance Technology with Large - Diameter Wafer Manufacturing © Aelu m a , Inc. All R i g ht s R e serve d . 5 In P : In d i u m P h o s p h i d e ; Source of image: https:// www.flir.com/support/products/swir - ingaas - fpa/; Note: Outcomes can
Slide 6: Aeluma's Technology Breakthrough
Conventional manufacturing of I n G aA s ph oto d etect or a r r ays arrays with Si l i c on m an u fac t u ri n g Highly automated and ability to produce many arrays per wafer 10X lower manufacturing cost for mass market applications 1 6 X w a fer a re a Movi ng f r om 3 - i nch t o 12 - i nc h w a
Slide 7: Aeluma's Cost-Effective Scalable Manufacturing
Aeluma’s Cost - Effective Scalable Manufacturing Large - Diameter Wafer Capability ● Commercial 12 - inch state - of - the - art deposition tool ● Set up for cassette (FOUP) loading production ● One of only a few such tools worldwide ● Extensive patent protection and trade secrets © Aelu m a , Inc.
Slide 8: Aeluma's Cost-Effective Scalable Manufacturing: Wafer Mapping
Aeluma’s Cost - Effective Scalable Manufacturing Large - Diameter Wafer Capability Phot olum i n e s ce n c e Ma p p i ng Me a su re m e n t s 8 - i n ch Wafer M ap O ver l aid Scan s Excellent Uniformity Across Wafer InP - o n - Si l i c on W a fer © Aelu m a , Inc. All R i g ht s R e serve d . 23
Slide 9: Wafer-Scale Integration and 3D Packaging
Wafer - Scale Integration and 3D Packaging Silicon Manufacturing Environment Enables Wafer - Scale Packaging © Aelu m a , Inc. All R i g ht s R e serve d . 9 Sources of images: A. Rogalski, Optical Engineering, 42(12), 2003; https:// www.allaboutcircuits.com/news/moores - law - xperi - new - die - t
Slide 10: Manufacturing for a Mass Market
Manufactu ring for a Mass Market Aeluma’s Large - Diameter Manufacturing Economies of Scale Automotive Sensors: Camera, Radar, and LiDAR © Aelu m a , Inc. All R i g ht s R e serve d . 10 Note: Outcomes cannot be guaranteed. Values are provided for qualitative illustration purposes only. 1 www.idc.co
Slide 11: Photodetector Array Performance
Ph o todetect o r A rr a y Perf o rma n ce Exemplary 128 X 32 InGaAs Array on 8 - inch Platform Dark C urrent H e at M ap ● P DA p i x el p i t ch = 9 0 m ; acti v e p i x el area = 8 5 m x 85 m ● Developed for a 1064nm LiDAR system ● Q ua n t u m eff i cie n cy = ~93% ● M eas u r eme n ts p e
Slide 12: Dark Current Temperature Dependence
Dark Cur r ent Temper a ture Dep e ndence Temperature - Dependent Dark Current © Aelu m a , Inc. All R i g ht s R e serve d . All mea s ureme nts p e rformed at - 5V bias Temperature - Dependent Dark Current Histograms T = 25 ƒ C A v g. I d ar k = 1 55 pA St d. De v . = 1 7 pA T = 5 5 ƒ C Av g . I d
Slide 13: Dark Current Temperature Dependence: Further Improvements
Dark Cur r ent Temper a ture Dep e ndence Further Improvements and Opti m ization T = 85 ƒ C Av g . I d ar k = 65 7 pA Std. De v . = 27 1 pA T = 1 0 5 ƒ C Av g . I d ar k = 2 . 3 6 n A Std. De v . = 1 . 2 5 n A SR3 3 - 1 S R 33 - 3 © Aelu m a , Inc. All R i g ht s R e serve d . All mea s ureme nts p
Slide 14: Aeluma Outperforms the Competition
© Aelu m a , Inc. All R i g ht s R e serve d . Note: Outcomes cannot be guaranteed. Metrics not based on actual data and are provided for qualitative illustration purposes only. Typical InP substrate sizes are 3 - or 4 - inch. Typical Si substrate sizes are 8 - or 12 - inch. APD: Avalanche photodiod
Slide 15: Summary of Product/Technology Offerings: Detector Arrays
Summary of Product/Technology Offerings D e te ct o r Arrays Cu s tom De t ect or Arrays • Low dark current photodetector arrays manufactured w i t h l ar g e - d i amet e r s ub s t ra t e pla t f o rm • Pixel and array size customizable • Typical array sizes: 128 X 32, 256 X 128, 640 X 512 • Deliv
Slide 16: Summary of Product/Technology Offerings: Large-Area InGaAs Detectors
Summary of Product/Technology Offerings Large - Area InGaAs Detectors High sensitivity, low dark current and high s p ee d de te ct o rs f or SWIR and XSWIR • Typical Photosensitive Diameter (D): 0.25 to 5.0mm • Typi c al O p e ra t i ng Wavel e n g t h ( ): 0. 9 5 t o 1.55 m) • D e vi c e : P I
Slide 17: Summary of Product/Technology Offerings: Heterogeneous Integration Platform
Summary of Product/Technology Offerings Applicable markets include automotive, mobile, AR/VR, defense & ae r o s pace, q u an t u m compu t i n g, AI, and com m un i cat i on Heterogeneous Integration Platform Summ ary of Of f e ri ngs © Aelu m a , Inc. All R i g ht s R e serve d . 8 Aeluma’s propri
Slide 18: Silicon Photonics and Laser Integration
© Aelu m a , Inc. All R i g ht s R e serve d . Silicon Photonics and Laser Integration Aeluma’s Technology Can Enable Process Integration 12 - inch Silicon Photonics Wafer with Aeluma Materials Outcomes cannot be guaranteed. 24 Data Cen t e r s AI and Photonic Computing Silicon Photonics Application
Slide 19: Automotive LiDAR: Aiming to Service a Broad Market
Au t omot i v e LiDAR Aiming to Service a Broad Market High - Performance Semiconductors for Sensing and Communications • C on su m er vehi c le s • Robotaxis • Trucking In d us t ri a l a nd Logistics Defe n se & Aerospa c e Mob i l e a nd AR/VR C omm un i c a t i o n s, Q u a n t um a nd AI • Robo
Slide 20: Conclusions
Co n clus i o n s ● Large - diameter wafer platform capable of scaling InGaAs detector arrays and other te c h nologi e s f or c o n s umer m a rke ts includ i ng aut o m o tive and m o bi le ● Demonstrated very low dark current detector arrays on 8 - inch wafer platform with excellent pixel yield,