Sivers Semiconductors Ab · OMXSTO:SIVE

Sivers Semiconductors Ab — Investor Day (May 2025)

22 slides from Sivers Semiconductors Ab's investor day presentation, May 27, 2025

  1. Slide 1: Business & Technology: Wireless

    Business & Technology Capital Markets Day May 27th, 2025 Harish Krishnaswamy, Managing Director Wireless

  2. Slide 2: SATCOM Boom Driven By Need for Connectivity Everywhere

    SATCOM Boom Driven By Need for Connectivity Everywhere SATCOM On the Telecomm Backhaul Consumer Move Aviation Maritime Military 35

  3. Slide 3: Fixed Wireless Access Is the “Killer” App 5G for mmWave

    Fixed Wireless Access Is the “Killer” App 5G for mmWave Driven by green-field markets (e.g. India) where incumbent infrastructure is lacking.

  4. Slide 4: Wireless Target Markets: A $1B SAM by 2030

    Wireless Target Markets: A $1B SAM by 2030 SATCOM 5G mmWave Defense/FR3 ✓Diverse market with many ✓ Fixed Wireless Access has ✓Radar/EW defense global and regional players. emerged as the key 5G applications can use Sivers’ mmWave driver. existing BFICs, or variants at ✓Current offerings are in Ka-

  5. Slide 5: Current SATCOM Networks Face Severe Challenges

    Current SATCOM Networks Face Severe Challenges 1 Satellite operators do not communicate with each other Ground terminals cannot 1 2 simultaneously communicate with multiple satellites 4 No convergence across orbits 3 (LEO, MEO and GEO) 3 No convergence across military 4 and commercial networks 5 No

  6. Slide 6: Sivers Features the Broadest mmWave IC Portfolio

    Sivers Features the Broadest mmWave IC Portfolio Frequency (Ku, Ka Band) (28, 39 & 60GHz) 5G SUMMIT Gen 1 Eder (60GHz) Rapinoe (28GHz) SATCOM Timberline (ALL.SPACE) Ibra (ALL.SPACE) Integration Performance High-Performance Beamforming ICs Highly-Integrated RFIC Transceivers 39

  7. Slide 7: Our Differentiating Features Address SATCOM Challenges

    Our Differentiating Features Address SATCOM Challenges Transmit Receive Frequency Full-aperture simultaneous multiple Multi-band (Ku-Ka) beamformer Sharing the aperture between beam formation enables make- designs enable terminals to transmit and receive reduces before-break and multi-orbit links co

  8. Slide 8: Customers, Product Expansion

    Customers, Product Expansion Capital Markets Day th May 27 , 2025 Harish Krishnaswamy, Managing Director Wireless

  9. Slide 9: Wireless Customers Ramping to Volume Production

    Wireless Customers Ramping to Volume Production Tier 1 Telco Infra Provider • Gen 1 Hydra-2 and Hydra-4 • Gen 1 product uses Sivers’ • Engagement includes in General Availability and broad-market 5G BFICs BFICs for ground segment deployed with US Army and and RFICs, and is expected and space payload

  10. Slide 10: Sivers Product Roadmap

    Sivers Product Roadmap Frequency (Ku, Ka Band) (28, 39 & 60GHz) Bifrost (Next-gen 5G 22FDX 5G Transceiver) SUMMIT Gen 2 Production SATCOM Cloudchaser (Ka Ku Standard Juniper Production KuKa Production Standard Product) Product BFIC (Thorium Space) (Thorium Space) 2025 2026 2027 Time Long-term produc

  11. Slide 11: Our Antenna Arrays, Panels Climb Up The Value Chain

    Our Antenna Arrays, Panels Climb Up The Value Chain Evaluation Small 5G/60GHz Large-Scale 5G Array Large SATCOM Kits Array Modules Modules Array Panels 44

  12. Slide 12: Recent Engagements Mark Our Entry Into Digital Subsystems

    Recent Engagements Mark Our Entry Into Digital Subsystems 45

  13. Slide 13: Business & Technology: Photonics

    Business & Technology Capital Markets Day May 27th, 2025 Andrew McKee, CTO Photonics

  14. Slide 14: The Fundamental Challenges facing AI Infrastructure Expansion

    The Fundamental Challenges facing AI Infrastructure Expansion 47

  15. Slide 15: Industry Leaders Agree that Optical Interconnect is Critical for the Success of AI

    Industry Leaders Agree that Optical Interconnect is Critical for the Success of AI “Over the past decade, NVIDIA-accelerated computing has delivered a million-X speedup in AI. The next million-X will require new, advanced technologies like optical I/O to support the bandwidth, power and scale requir

  16. Slide 16: The Solution – Replacing Cu Interconnects with Optics

    The Solution – Replacing Cu Interconnects with Optics 16 wavelengths on 16 fibers Silicon Photonics Micro Ring Resonators (MRR) Co- at 64Gb/s = 16Tb/s packaged with GPUs/ASICs are the clear lead Technology fibers Key Advantages of DWDM Microring Resonators 1. Energy Efficiency. The only solution tha

  17. Slide 17: The Sivers Solution - Supplying Laser Sources for CPO

    The Sivers Solution - Supplying Laser Sources for CPO • Technology Leader in this space • Built on 25yrs of Advanced Laser development in telecoms PON networks and sensing applications • Significant strength in Design IP and patented technology • Advanced wafer process technology • Ridge waveguide L

  18. Slide 18: Co-Packaged Optics I/O Solution

    Co-Packaged Optics I/O Solution Ayar Labs TeraPHYTM CMOS Optical Interconnect Chiplets Converting data into the Optical Domain as locally as possible Bi-directional data connectivity GPU-GPU GPU/CPU/FPGA Ayar SuperNovaTM multi-fibre, multi-wavelength light source Sivers 16x Wavelength Laser Array 51

  19. Slide 19: Silicon Photonics MRR Broader Landscape

    Silicon Photonics MRR Broader Landscape 52

  20. Slide 20: Industry MSA Consortium Defining Laser Standards for MRR Architecture

    Industry MSA Consortium Defining Laser Standards for MRR Architecture • Standards defined by Tier-1 Optics Companies including Sivers • Demonstration of Intense Interest in MRR architecture • Strong involvement from industry leaders 53

  21. Slide 21: Volume Production 2027+

    Volume Production 2027+ ✓ Technology ✓ Product Product Manufacturing Development Demonstration Qualification Readiness • Technology developed and hardened • Production ramping with lead customers in 2027 • AI GPU shipments in 2028 forecasted to be 19.0m • MRR Architecture requiring >5 laser sources

  22. Slide 22: Summary

    Summary • Mega trends in AI infrastructure being driven by rapid increases in compute performance and demand for lower power consumption • Current I/O solutions (Copper, Pluggable Optics) cannot deliver the required improvements • Intense interest and activity now in Microring Resonator (MRR) Archit

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