Silvaco Group, Inc. · NASDAQ:SVCO

Silvaco — Technical Presentation (2023)

10 slides from Silvaco's technical presentation, Jan 13, 2023

  1. Slide 1: The Four Process Simulation Options Modeling

    The Four Process Simulation Options Modeling Geometric Emulation Physical

  2. Slide 2: Contents

    Contents • Four Process Simulation Options 1. Solid modelling approach 2. Fast prototyping builder using geometric style etch/deposit 3. Topographical (rule based) process emulation etch/deposit 4. Simulation of chamber physics for etch/deposit/oxidize • Other physics or rule based options for impla

  3. Slide 3: Four Process Simulation Options

    Four Process Simulation Options • The purpose of a process simulator is to create a virtual representation of a physical structure. • There are four basic ways to create the structure: 1. Solid modelling (assembly of geometric shapes) 2. Process simulation using geometric style etch/deposit 3. Use a

  4. Slide 4: Solid Modeling Approach

    Solid Modeling Approach • In this most basic approach, various shapes are created using a solid modelling tool which are then “stitched” together to form the basic simulated structure • An exploded diagram (left) shows constituent parts of a FinFET structure created entirely using solid modeling ©20

  5. Slide 5: Geometric Operations for Etch/Deposit

    Geometric Operations for Etch/Deposit • After loading mask data, the process run sheet is followed to create the structure but etch and deposit steps are limited to geometric functions of the masking layers • Fast prototyping simulations of large structures are possible ©2023 Silvaco, Inc. 5

  6. Slide 6: Topographical Process Emulation

    Topographical Process Emulation • After loading mask data, the process run sheet is followed to create the structure as before • However, an Emulation style engine uses topographic based mathematical functions, to create more complex conformal layer deposit and rounded etch shapes ©2023 Silvaco, Inc

  7. Slide 7: Chamber Physics Simulation for Etch/Deposit/Oxidation

    Chamber Physics Simulation for Etch/Deposit/Oxidation • A step towards further predictable simulation, is to simulate the basic etch/deposit chamber physics • Typical inputs for the model are material and incoming particle angular dependency of etch/deposit rates, sticking coefficients, polymer re d

  8. Slide 8: Other Physics or Rule Based Options

    Other Physics or Rule Based Options • Silvaco also provides physics or rule based model options, for implant, diffuse and oxidation process steps • This mix and match approach facilitates very flexible structure creation techniques ©2023 Silvaco, Inc. 8

  9. Slide 9: Integrated Stress Analysis

    Integrated Stress Analysis • Structure stress can be analyzed at key points during structure creation, or at every step during the structure creation process flow (“stress history” feature) ©2023 Silvaco, Inc. 9

  10. Slide 10: Summary

    Summary • Four process simulation options are available • Physics or rule based options for implant/diffuse • 3D physics based crystal direction dependent oxidation • Mix and match approach facilitates great flexibility • One tool set for large geometric structures, and detailed analysis of etch, de

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