Tower Semiconductor Ltd. · NASDAQ:TSEM

Tower Semiconductor — Q3 2024 Earnings Presentation

11 slides from Tower Semiconductor's earnings presentation, Nov 13, 2024

  1. Slide 1: Third Quarter 2024 Financial Results Conference Call

    Third Quarter 2024 Financial Results Conference Call Supporting Slides November 13, 2024

  2. Slide 2: Safe Harbor

    This presentation contains forward-looking statements within the meaning of the “safe harbor” provisions of the Private Securities Litigation Safe Reform Act of 1995. These statements are based on management’s current expectations and beliefs and are subject to a number of risks, uncertainties and a

  3. Slide 3: 2024 Revenue Performance and Guidance

    2024 Revenue Performance and Guidance 390 $387M 380 370 $370.5M 360 350 $351M $M 340 330 $327M 320 310 300 Q1'24 Q2'24 Q3'24 Q4'24F* * Q4’24 revenue represents mid-range guidance

  4. Slide 4: Q3 2024 Revenue Breakdown by Technology

    Q3 2024 Revenue Breakdown by Technology Q3’24 Sensors & Q2’24 Display Misc. 2% Discrete 14% 17% Discrete Sensors & 13% Display 18% Power Power RF Mobile 17% 15% 26% MS/CMOS RF RF Mobile MS/CMOS 7% Infrastractu 31% RF 8% re 18% Infrastracture 14% Automotive: 11% Automotive: 10%

  5. Slide 5: Active Copper Cables

    Active Copper Cables • Active Copper Cables: with SiGe based linear equalizers (redrivers) • Active Electrical Cables: with SiGe based analog clock and data recovery (retimers) Source: FS.com, Cadence

  6. Slide 6: SiGe Wafer Revenue, TAM ($M)

    ACC: 6X Growth in SiGe Wafer TAM from ‘23 to ’28 Dominated by >400G Networking Cables SiGe Wafer TAM for ACC Cable Front Ends 80 <400G >400G 70 SiGe Wafer Revenue, TAM ($M) 60 50 40 30 20 10 - 2023 2024 2025 2026 2027 2028 Wafer Shipment Year Sources: Lightcounting ’22, ’23 and company estimates 6

  7. Slide 7: Tower's 65nm BCD fits Power ICs in Smartphone

    Tower’s 65nm BCD fits Power ICs in Smartphone 65nm 5V BCD 65nm 3.3V BCD Est. 12” Wafer Platform (PMK) Platform (PML) TAM [KWPM] ✓ Wide offering for different ICs ✓ Wide offering for different ICs Other Regulators, Haptic drv., MS IC 22 ✓ Rich Analog & power 5V based ✓ Rich Analog & power 3.3V based

  8. Slide 8: 65nm BCD Modularity

    65nm BCD Modularity Widest Coverage Power & Analog applications with best-in-class FOMs 3.3V or 5V Power Device 1.2V Core Analog BEOL Mixed Signal 3.3V or 5V Mixed Signal Best in class LDMOS Standard cell libraries 1.2V/3.3V/5V Analog 2 to 6 level metal Rich device list DEMOS options Memory compiler

  9. Slide 9: High Resolution Industrial & Digital Photography

    High Resolution Industrial & Digital Photography • Tower Semiconductor offer : • 300mm 65nm process, Back Side Illuminated / stacked • Unique Technologies: • 300mm Stitching and Stacking capabilities • Low noise Charge domain global shutter for next generation DSLR/MLC • High Dynamic Range pixels •

  10. Slide 10: Micro Displays – OLED On Silicon (OLEDoS)

    Micro Displays – OLED On Silicon (OLEDoS) • Tower Semiconductor offer : • 300mm 65nm process for OLED CMOS backplanes • Wafer revenue, SAM and Market share • CAGR : 50% • Unique Technology : • Dedicated devices for OLEDoS: • Ultra low leakage dedicated transistors • High density, in-pixel capacitors

  11. Slide 11: Thank You

    Thank You Contact: Noit Levy, SVP Human Resources, Investor Relations and Corporate Communications Email: noitle@towersemi.com

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