Slide 1: ASML London UBS Technology Conference
Exhibit 99.1 ASML London 12 March, 2013 UBS Technology Conference
Slide 2: Forward-looking statements
ASML statements, and uncertainties semiconductors products acceptance equipment, including our consider documents ability lithography Forward carefully and whether to filed of trade including including, pricing, successfully new (the systems looking by environment, the products, ASML principal the s
Slide 3: ASML Business Strategy
ASML ASML Business Strategy Public Slide 3
Slide 4: Business principles: roadmaps
ASML Business principles: roadmaps reliability and (Moore’s •Execute uptimes Model Law) an•Reducing appropriate – Focus •Offering oncycle level “right ongoing times ofproducts R&D improvements between toon offer time” customer theinOur required imaging, order business technologies and overlay model
Slide 5: Affordable shrink roadmap
ASML NXE:3300B, NXE:3350, … NXT:1950i, NXT:1960Bi, NXT:1970Ci Affordable shrink roadmap 2012 2013 2014 2015 2016 2017 450mm 2018 2019 2020 EUV Immersion QXT, QXE Slide 5 Public
Slide 6: ASML product strategy: immersion, EUV and 450mm
ASML Public 450mm throughput, capability overlay SlideOver 6and Focus 420 imaging ASML on dual (CDU) immersion product optimized strategy systems fortomulti-pass in match use today customer patterning 6 ASML roadmaps atEUV 20nm •Preparing system and below in use EUV•Introduce today platform TWINSCAN
Slide 7: Immersion extensions roadmap
ASML Extensions 190 WPHPublic 230 2013+ Slide WPH Matched 7250 ASML WPH Machine Immersion Defects Overlay (ASML Product 5.5nm test) Roadmap 4.5nm 10 defects/Wafer NXT:1950i 3.5nm On Product 10 provides defects/Wafer Overlay performance 9nm <7 defects/Wafer 6nm extendibility 4nm * CDU * until OPO3nmE
Slide 8: Holistic Lithography with YieldStar
supportsASML’s ASML Yieldstar full integration Holistic application to Lithography deliver platform improved Solutions ( one per On-Product fab support ) multi-pass Performance patterning for 20 nm at 20nm node and beyond, below ASML will support ScannerEUV Process in future window Yieldstar enlarge
Slide 9: EUV progress: source power and imaging
ASML extended, with good EUVstable debris progress exposure control encouraging •11 power system up•Imaging to ship 40plan Watts, on forthe good 2013 production dose Public control, Slide capable full 9 NXE:3300B, field exposures shows •55 Watts excellent shown single in short imaging runsresults wi
Slide 10: NXE:3300B system development
ASML Public tool Development SlideSystem 10 Eleven 2 System NXE:3300B 8 Training systems 10 Tool in various New cleanroom states of integration in new clean room completed in 2012 System 3 System 1 System 9 System 4 System 7 System 5 System 6
Slide 11: EUV technology roadmap and extendibility
ASML s=0.8 Wavelength —60 —50—125 Extended Punlicl [nm] Slide Flex-OAI 125 4.011 7125 3.0 Under 20 reduced DCO 500 study [nm] 165 pupil Resolution MMOfill ratio [nm][nm] 0.33NA 7.032 —5.0 27 DPT 22 1.216 s=0.5 1.5 131.0 10 s=0.2-0.9 2.0 7 <72.5 layout coherence 1.7 Overlay NA 0.25 NXE 100.33 5techno
Slide 12: Acceleration of EUV and 450mm development: Co-Investment Program
ASML ASML Acceleration systems in 2018 ofintends EUV (300mm development to spend and 450mm € 750 of 800 machines compatible) million and in450 sources R&DmminASML including 2013 Co-Investment Customer next generation Co-Investment participants EUV systems Program are expected Development allowstoinc
Slide 13: Cymer merger: clearance status
ASML ASMLCymer clearance shareholders hasFebruary been granted merger 2013by Awaiting agreement the Committee regulatory statuson In approvals Foreign Q4 2012,Investment from we announced US, Japan in thethe United andintended Korea States We cash-and-stock (CFIUS), continue the to expect acquisitio
Slide 14: ASML
ASML