Tdk Corporation · TSE:6762
Tdk — Investor Presentation (March 2024)
12 slides from Tdk's investor presentation, March 2024
Slide 1: ModCap MF
ModCap MF DCR Modular | New Modular High Frequency Series TDK Electronics Components, S.A.U. Aluminum and Film Capacitors Business Group Product Marketing Malaga, Spain March 2024
Slide 2: Introducing the New Modular Standard Series Highlights
Introducing the New Modular Standard Series Highlights Compact solution with Product developed very high energy density according to fire safety standards ModCap MF Low ESL (<14 nH) Reduce time to market to avoid use of & lead time additional snubbers Traction, industrial drives Cost saving solution
Slide 3: ModCap MF Series | B25645A*
ModCap MF Series | B25645A* ~ AC filter = DC link/DC filter MKK HP ModCap MF MKK DCR MKK DCi-R MKK DCi-H © TDK Electronics Components, S.A.U. 2024 Product presentation · ModCap MF B25645A* CAP FILM ES HP PM March 2024 3
Slide 4: DC-Link Applications
ModCap MF Series | B25645A* DC-Link Applications Energy transmission Renewable energies Traction Industry Solar Loco & EMU LV Wind Light trains MV © TDK Electronics Components, S.A.U. 2024 Product presentation · ModCap MF B25645A* CAP FILM ES HP PM March 2024 4
Slide 5: General Overview B25645A* Series
General Overview B25645A* Series = ModCap HF (dry-modular-high frequency) Features Benefits ● Capacitance range from 350 up to ● High energy density, ultra compact 3900 µF solution ● Voltage range from 900 up to ● Modular concept for parallel 2300 V DC connection ● Low ESL <14 nH ● Snubber avoidance
Slide 6: Construction A Simplified Drawing & 3-D
Construction A Simplified Drawing & 3-D Main dimensions: 243 x 169.5 x 90 mm Terminal © TDK Electronics Components, S.A.U. 2024 Product presentation · ModCap MF B25645A* CAP FILM ES HP PM March 2024 6
Slide 7: Construction B Simplified Drawing & 3-D
Construction B Simplified Drawing & 3-D Main dimensions: 258 x 215 x 115 mm Terminal © TDK Electronics Components, S.A.U. 2024 Product presentation · ModCap MF B25645A* CAP FILM ES HP PM March 2024 7
Slide 8: Highlights: Compactness, Low ESL & Higher Operation Temperature
Highlights: Compactness, Low ESL & Higher Operation Temperature Compact power unit ● Capacitors can be mounted very close to the power modules to reduce loop inductance. ➔ Ultra compact solution ➔ Less investment on cooling ● Very short connection between capacitor and semiconductor ➔ Low ESL (<14 n
Slide 9: Electromagnetic Behavior of Modular Standard Series
Electromagnetic Behavior of Modular Standard Series Electromagnetic: Modelling Customer benefits Customer input Current-frequency spectrum ● Electromagnetic model available for specific TDK input simulation according to current-frequency Capacitor design spectrum defined by the customer. Simulation
Slide 10: Thermal Behavior of Modular MF Series
Thermal Behavior of Modular MF Series Thermal: Hot spot & temperature maping Customer benefits ● Thermal model available for specific simulation according to spectrum and boundary conditions defined by the customer. ● Thermal simulations to be integrated as part of the type test report. ● Thermal si
Slide 11: ModCap MF Ordering Code System
ModCap MF Ordering Code System Repetitive Nominal Capacitance Nominal Surge Dimensions Part peak Con-struction voltage (V) ±10% (µF) current (A) current (kA) (L x W x H, mm) number current (kA) 2075 200 225 5 205x90x170 A B25645A9218K003 900 3900 155 250 5 220x115x215 B B25645A9398K003 1705 190 220
Slide 12: www.tdk-electronics.tdk.com
www.tdk-electronics.tdk.com