Slide 1: Lemtech Holdings Co., Limited
Lemtech Holdings Co., Limited Hee Fe ST GATT AY LE Ae Fil
Slide 2: 摘要
摘要 公司簡介 核心業務 - 模具設計製造能力 - 手機沖壓業務 - 汽車業務 - 3C產品散熱業務 - 伺服器領域新技術研發 - 伺服器滑軌業務開發 尊貴的客戶群 財務報告
Slide 3: 公司簡介
公司簡介 • Global Provider of Choice for : Precision Tooling, Metal Stamping, Electro- Mechanical & Custom Sub Assy Solutions; with expertise in Thermal Solutions, Metal Hinges & Slide Rails for the Computing, Consumer, Automotive & Infrastructure Industry • Manufacturing sites/offices in 4 countries •
Slide 4: Global locations and manufacturing sites
•AS • TAIWAN Taipei (HQ) •USA • China • • Taiwan • CHINA •Thailand • Kunshan • Hong Kong • THAILAND • Ayutthaya • USA •• 5 Manufacturing Sites/Offices • San Jose, CA • ~ Total Floor Space: 500,000 sqft • ~ Total Headcount 1,200
Slide 5: mii = B
mii = B
Slide 6: 模具設計製造能力
模具設計製造能力
Slide 7: Product Design Platforms Tool Design Platforms
Product Design Platforms 3D : Solidworks/pro-E 2D : AutoCad Tool Design Platforms 3D : Key creator 2D : PressCad
Slide 8: Tool Room Equipment
Tool Room Equipment CNC Wire EDM Area AgieCharmilles - Wire EDM Surface Grinders Horizontal CNC Machining Center Vertical CNC Machining Center
Slide 9: Tool Room Overview
Tool Room Overview Machining Center area overview Tool Assembly area
Slide 10: Stamping Presses from 25 Tons to 800 Tons (120 units)
Stamping Presses from 25 Tons to 800 Tons (120 units)
Slide 11: Secondary Processes: Robotic Welding, Staking & Tapping
Secondary Processes: Robotic Welding, Staking & Tapping Staking m/c Robotic welding machine Resistant welding m/c Multi-spindle tapping m/c
Slide 12: Quality System
Lemtech Holdings Co., Limited Quality System M Certificat M Certificat| | certiercatron N° 2007/29622b | res en | CERTIFICATE OF REGISTRATION KUNSHAN LEMTECH PRECISION KUNSHAN LEMTECH PRECISION ENGINEERING CO., LTD. ENGINEERING CO., LTD. wr 3 FBLA ES ISO/TS 16949 : 2009 ISO 9001 : 2008 afnor
Slide 13: F te it} Be
F te it} Be
Slide 14: Stamping for Consumer Electronics
Stamping for Consumer Electronics
Slide 15: Power/Volume/Ear Key of Mobile Phone series
Power/Volume/Ear Key of Mobile Phone series Cellphone Earphone Ring Cellphone Volume Key Cellphone Power Key Cellphone Volume Key
Slide 16: Lemtech Holdings Co., Limited
Lemtech Holdings Co., Limited
Slide 17: Parts For Various Automotive Applications
Parts For Various Automotive Applications Airbag Systems Seatbelt Systems Door Hinges Sunroof and Others
Slide 18: 3C = on Al AA
3C = on Al AA
Slide 19: R&D Design Software - Simulation
•R & D Design Software - Simulation Icepak Flotherm
Slide 20: Thermal Module Assembly & Test Equipment
Thermal Module Assembly & Test Equipment Assembly line Performance test Automatic grease application m/c Fan test
Slide 21: Our Products – Heat Sinks for Consumer Electronics
Our Products – Heat Sinks for Consumer Electronics
Slide 22: Heat Sinks and Stampings for Consumer Electronics
Heat Sinks and Stampings for Consumer Electronics
Slide 23: Solder-Free Heat Sink Solution for Enterprise Computing
SOLDER-FREE Heat Sink Solution for Enterprise Computing
Slide 24: fea) AiR ais ZEB eT Fe Ala Oo Sk
fea) AiR ais ZEB eT Fe Ala Oo Sk
Slide 25: Thermal issue for Data Center
Thermal issue for Data Center The cooling system plays a crucial role in a data center system. It dominates the concept of construction, facility/operation cost and efficiency. Cooling tower Chiller Data center racks Hot Aisle •Source: http://www.google.com/about/datacenters/ • Cost of data center s
Slide 26: Lemtech New technology: SPHP
Lemtech New technology : SPHP Innovative design to increase performance and reduce cost Passive, two-phase device with remote condenser Minimize gravity impact at performance Allows for compliance on evaporators(alleviates co-planarity issues) Flexible placement of evaporators and condense
Slide 27: Market opportunity / Lemtech superiority
Market opportunity • MarketsandMarkets research : Global data center cooling market will come in 10.4% annual growth over the next four years. • Intel’s financial statements for Data Center Group : 2013 revenues were $11.2 billion and about 19 million CPUs (and heat sinks) sold. • DCD Intelligence :
Slide 28: fol AR as is BS Gel
fol AR as is BS 35 Gel 88
Slide 29: Slide Rails for Enterprise Enclosures
Slide Rails for Enterprise Enclosures (inc Tool-Less Design Options) Wide View
Slide 30: Front Mounting Rear Mounting
Front Mounting Rear Mounting
Slide 31: Lemtech Holdings Co., Limited
Lemtech Holdings Co., Limited
Slide 32: Automotive
as Lemtech Holdings Co., Limited Automotive BorgWarner Apollmsan | INNOVATION W
Slide 33: Computing & Consumer Electronics
Computing & Consumer Electronics
Slide 34: Fl WR S
Fl 4 WR S
Slide 35: 近六季稅後淨利及每股盈餘
近六季稅後淨利及每股盈餘 單位：新台幣仟元 2013Q1 2013Q2 2013Q3 2013Q4 2014Q1 2014Q2 2014Q3 合併營收 420,642 459,201 639,526 595,522 616,858 689,635 877,866 銷貨毛利 90,606 99,207 145,507 136,132 121,620 155,980 205,361 營業淨利 33,118 32,734 69,056 36,763 31,299 73,932 111,108 稅後淨利 26,340 22,260 59,376 23,257 28,535 53,172 45,544
Slide 36: 近六季財務比率表
近六季財務比率表 2013Q1 2013Q2 2013Q3 2013Q4 2014Q1 2014Q2 2014Q3 毛利率(%) 21.54 21.6 22.75 22.86 19.72 22.62 23.39 獲力 費用率(%) 13.67 14.48 11.95 16.69 14.64 11.90 10.74 能力 營業利益率(%) 7.87 7.13 10.8 6.17 5.07 10.72 12.66 負債比率(%) 32.71 46.14 47.16 52.68 48.66 57.16 59.53 財務 結構 現金與約當現金 120,260 188,198 193,396 378,6
Slide 37: 近六季簡明資產負債表
近六季簡明資產負債表 2013Q1 2013Q2 2013Q3 2013Q4 2014Q1 2014Q2 2014Q3 流動資產 1,064,783 1,134,586 1,219,381 1,475,767 1,345,217 1,589,113 1,950,860 不動產、廠房 408,671 449,803 483,252 569,940 618,253 601,074 602,758 及設備 其他資產 105,402 147,316 156,493 111,849 74,437 104,225 115,717 資產總額 1,578,856 1,731,705 1,859,126 2,1
Slide 38: 產品概況
產品概況 2013Q1 2013Q2 2013Q3 2013Q4 2014Q1 2014Q2 2014Q3 A-散熱 34.27% 40.57% 43.31% 50.14% 39.11% 36.52% 50.39% B-手持 13.47% 9.02% 19.38% 6.44% 17.51% 20.72% 18.64% C-車類 30.71% 31.19% 24.43% 31.34% 29.57% 26.73% 26.06% D-其他 21.55% 19.22% 12.88% 12.08% 13.81% 16.04% 4.92% 120.00% 100.00% 80.00% D-其他 60.00
Slide 39: Lemtech
LEMTECH … Your Trusted Partner in Business www.ky-lemtech.com