Vicor Corporation · NASDAQ:VICR

Vicor — Technical Presentation (2024)

36 slides from Vicor's technical presentation, 2024

  1. Slide 1: Powering the next-generation of advanced test and measurement systems

    為下一代先進的測試和量測系統提供動力 Powering the next-generation of advanced test and measurement systems Vicor Taiwan FAE Jeff Chang 張仁程 ©2024 Vicor 1

  2. Slide 2: Powering the next-generation of advanced test and measurement systems

    為下一代先進的測試和量測系統提供動力 Powering the next-generation of advanced test and measurement systems  Next generation ATE market trends and  ATE application with Vicor high- Power requirement performance power modules  Test and measurement system power – Semiconductor ATE solution – Burn-In tester – Discrete

  3. Slide 3: Next generation ATE market trends and power requirements

    Next generation ATE market trends and power requirements ©2024 Vicor 3

  4. Slide 4: ATE market overview

    ATE market overview  Global ATE market size is valued at $8.5B in 2022 grows to $20B by 2032 – 10% CAGR  Global IC market CAGR is 7.5% to $650B by 2025  Largest IC growth in automotive and industrial markets  Advantest and Teradyne dominate the ATE business at 80% of market  Processor products

  5. Slide 5: ATE market trends

    ATE market trends  Rapid growth of the automotive and semiconductor industries  Increasing demand for consumer electronics products  Government regulations promoting development of semiconductor industry  Grading products more important to hit high performance price points  Increased capacity t

  6. Slide 6: Test and measurement system power solution

    Test and measurement system power solution Discrete vs. modular comparison ©2024 Vicor 6

  7. Slide 7: Test and measurement system power solution – discrete vs. modular comparison

    Test and measurement system power solution – discrete vs. modular comparison Feature Discrete Vicor power modules In-house power design Extensive engineering skill needed Minimal engineering skill needed Size Larger BOM and PCB area Small and compact Weight Bigger BOM/larger PCB make it heavier in m

  8. Slide 8: Test and measurement system power solution – discrete vs. modular comparison

    Test and measurement system power solution – discrete vs. modular comparison  Modules have a higher power density and in most cases are more efficient  Power delivery network that drives more power in less space  Modules provide the flexibility and scalability needed to make design changes quickl

  9. Slide 9: Vicor value proposition in next generation ATE

    Vicor value proposition in next generation ATE ©2024 Vicor 9

  10. Slide 10: Market needs vs. Vicor value proposition

    Market needs vs. Vicor value proposition Market needs Vicor value proposition Faster/higher throughput Small size allows ATE manufacturers to power more pins in same or smaller test head Small as possible ATE floor High power density to increase test capacity without increasing system space requirem

  11. Slide 11: Positioning: Vicor value proposition in ATE

    Positioning: Vicor value proposition in ATE  Increase speed of testing, requires  Factorized Power Architecture allows smaller, faster moving test head separation of transformation and isolation  Minimize set-up time by broadening from regulation, reducing size and weight of capabilities of teste

  12. Slide 12: The four pillars of Vicor power system innovation

    The four pillars of Vicor power system innovation Unique Innovative architectures control systems Proprietary Advanced components topologies and packaging ©2024 Vicor

  13. Slide 13: Vicor power module families

    Vicor power module families DCM DC-DC BCM bus converter converters modules PRM pre- and post- ZVS buck-boost transformation regulators regulators VTM current ZVS buck regulators multipliers ©2024 Vicor 13

  14. Slide 14: ATE application with Vicor high-performance power modules

    ATE application with Vicor high-performance power modules ©2024 Vicor 14

  15. Slide 15: Semiconductor ATE solution

    Semiconductor ATE solution Increase speed and throughput of automated test station Customer challenges  Achieving maximum power density with low MTBF and FIT metrics  The number of IC pins to be tested is rapidly increasing  Test equipment requires low noise and variable output ©2024 Vicor 15

  16. Slide 16: Semiconductor ATE solution

    Semiconductor ATE solution  Vicor Factorized Power Architecture (FPA) allows separation of regulation and transformation/isolation  PRM regulator modules provides regulation away from the load  VTM current multipliers at the point-of- load to minimize PCB real estate needed at the space-limited t

  17. Slide 17: Vicor Semiconductor ATE solution advantage

    Vicor Semiconductor ATE solution advantage  High switching frequency of the VTM SAC topology minimizes output ripple  Use of power components makes it easy to implement additional load voltages  Adjustability of output removes need for equipment change, reducing set-up time significantly ©2024 Vi

  18. Slide 18: Vicor Value in Semiconductor ATE

    Vicor Value in Semiconductor ATE Minimize the cost-of-test for Automated test equipment Powering size-constrained test end customers customers are competing head with maximum to provide the lowest possible power density enables more cost-of-test to their customers components to be tested simultaneou

  19. Slide 19: Burn-In tester

    Burn-In tester Customer challenges  More space needed for processing electronics  Power supply should support the increased load demands in the reduced footprint available  Increased power means increased heat in the system, requiring improved cooling  Minimizing operating costs  Low noise and

  20. Slide 20: Memory Burn-In tester solution

    Memory Burn-In tester solution  A move to a 48V bus architecture reduced system distribution losses  A BCM Bus Converter Module converted the 48V bus to a non-regulated 12V rail  DCM DC-DC converters provided the 31V and 19V rails ©2024 Vicor 20

  21. Slide 21: ASIC Burn-In tester solution

    ASIC Burn-In tester solution  Vicor Factorized Power Architecture (FPA) allows separation of regulation and transformation/isolation  PRM regulator modules provides regulation away from the load  VTM current multipliers at the point- of-load to minimize PCB real estate needed at the space-limited

  22. Slide 22: Vicor Burn-In tester solution advantage

    Vicor Burn-In tester solution advantage  Small footprint of BCM and DCM provides space for other functionality  Double-sided conduction cooling and low profile of BCM and DCM allows increased airflow and improved system cooling  High efficiency switching topologies reduced waste heat and reduced

  23. Slide 23: Vicor Value in Burn-In tester

    Vicor Value in Burn-In tester Highest power density Tested a greater Reduced cost and Low EMI number of devices in time for testing and best-in-class parallel without thermal having to expand management current footprint ©2024 Vicor 23

  24. Slide 24: Battery formation/tester

    Battery formation/tester Customer challenges  More space needed for processing battery formation  Increased battery testing throughput without increasing floor space.  HV Bi-directional operation  Versatile and reliable required  Minimizing operating costs  High efficiency/Power density requir

  25. Slide 25: Battery formation Power Delivery Network

    Battery formation Power Delivery Network BCM6123 bus converters Input: 260 – 410V (384V nom) Output: 8.1 – 12.8V (12V nom) Power: Up to 320W Efficiency: Up to 97.9% 63.3 x 22.8 x 7.2mm vicorpower.com/bcm ©2024 Vicor 25

  26. Slide 26: Battery testing Power Delivery Network

    Battery testing Power Delivery Network BCM6123 bus ZVS buck converters regulators Input: 260 – 410V (384V nom) Input: 12V (8 – 18V), 24V (8 – 42V), 48V (30 – 60V) Output: 8.1 – 12.8V (12V nom) Output: 2.2 – 16V Power: Up to 320W Current: Up to 22A Efficiency: Up to 97.9% Efficiency: Up to 98% 63.3 x

  27. Slide 27: Vicor Value in Battery formation/tester

    Vicor Value in Battery formation/tester Maximize throughput and adapt to change quickly and easily High density and High current capability Low height Scalable and flexible efficiency ©2024 Vicor 27

  28. Slide 28: Instrumentation

    Instrumentation Customer challenges  Space constraints limit performance – Maintaining signal integrity – Managing excessive heat  High performance with low noise required  Efficient thermal management required  ASIC load tester less 1V design challenge ©2024 Vicor 28

  29. Slide 29: Instrumentation solution

    Instrumentation solution VTM current NBM fixed-ratio DCM DC-DC multipliers DC-DC converters converters Input: 0 – 60V Input: 36 – 60V Input: 9 – 420V Output: 0 – 55V Output: 7.2 – 15.3V Output: 3.3, 5, 12, 13.8, 15, 24, 28, 36, 48V Current: Up to 115A Power: Up to 2400W Power: Up to 1300W Efficiency

  30. Slide 30: Vicor Value in Instrumentation

    Vicor Value in Instrumentation The lowest noise and best thermal management for test and measurement Modular, scalable Improved thermal Low noise High power density power delivery management ©2024 Vicor 30

  31. Slide 31: Case studies and success stories

    Case studies and success stories ©2024 Vicor 31

  32. Slide 32: High density, modular testing for CPUs, GPUs, and SoCs

    High density, modular testing for CPUs, GPUs, and SoCs Semiconductor manufacturers rely on high-density test systems to support their growing portfolios of increasingly complex products 。 VTM current NBM fixed-ratio DCM DC-DC multipliers DC-DC converters converters Input: 0 – 60V Input: 36 – 60V Inp

  33. Slide 33: Increasing capacity of semiconductor burn-in thermal chambers

    Increasing capacity of semiconductor burn-in thermal chambers  Chambers increasingly more prevalent as high-reliability end markets require semiconductor ICs that achieve the highest levels of quality, BCM bus NBM fixed-ratio reliability and stability. converters DC-DC converters  Vicor can help a

  34. Slide 34: Precision inspection equipment

    Precision inspection equipment Wafer-level automated visual inspection systems ensure the highest quality and reliability of semiconductor ICs and enable manufacturers to continuously improve yields. DCM DC-DC BCM bus ZVS buck converters converters regulators Input: 9 – 420V Input: 800 – 48V Input:

  35. Slide 35: Battery formation/test equipment

    Battery formation/test equipment  Battery formation/test equipment higher output power requirement for new gen. with the same system side, need HV to reduce total BCM bus ZVS buck manufacture cost for converters regulators >50A application Input: 800 – 48V Input: 12V (8 – 18V), 24V (8 –  BCM6123 p

  36. Slide 36: Thank you

    VICOR Thank you ©2024 Vicor

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