Slide 1: Market Overview & Ambition 2030 (Burkhardt Frick)
Market Overview & Ambition 2030 (Burkhardt Frick) Public I SUSS Capital Markets Day 2025 1
Slide 2: Our strategic growth plan builds on in-depth market research and industry investigations
Our strategic growth plan builds on in-depth market research and industry investigations 1 2 3 4 Insights from Development roadmap of Studies by global consulting Application & roadmap industry peers leading research institutes and research leaders discussions with industry leaders Source: ASML Sour
Slide 3: Today's tech trends, accelerated by AI, are built on semiconductors
Mobility Social Software- Autonomous Metaverse Healthcare Defined driving (AR/VR) & Med-Tech/ Vehicles Wearables Automotive Hyperconnec- Electrification tivity – 6G Today’s tech trends, Electrification/ Green power Industrial Automation Edge (AI-) Computing Internet of Things accelerated by AI, are
Slide 4: AI-led secular trends are driving semiconductors toward a $1 trillion market by 2030
AI-led secular trends are driving semiconductors toward a $1 trillion market by 2030 Semiconductor device revenue Market segment Growth-drivers forecast (€bn) & key growth driver AI (Generative-, Agentic-, Physical-AI) Key growth driver Computing & Autonomous driving CAGR: ≙ 1 Trillion $ ~7%1 Data S
Slide 5: Rising application requirements are blurring the lines between Frontend & Backend
Rising application requirements are blurring the lines between Frontend & Backend territories – addressed in our Business Unit strategy Frontend Backend Node size mitigation: Moore’s Law continues with nodes Advanced Packaging: evolution & broad shrinking toward Ångström era adoption of heterogeneou
Slide 6: Node size mitigation: Moore's Law continues, mid-end nodes maintain high revenue share
Node size mitigation | Moore’s Law continues, yet decelerates, Mid-end nodes maintain high revenue share – we serve a broad spectrum Moore’s Law will continue; Node size (leading-edge) in nm With our photomask portfolio despite slow-down in Roadmap ASML we address the semicon- geometrical scaling 5
Slide 7: Advanced Packaging: Strong growth ahead, fueled by 2.5D and 3D packaging
Advanced Packaging | Strong growth ahead – largely fueled by 2.5D and 3D packaging Interconnection of chips, wafers, and As demand for high-performance computing rises, the value in interposers (e.g., Redistribution Layers, Advanced Packaging is shifting toward high-end technologies Through-Interpos
Slide 8: 2.5/3D Chiplet Technology: SUSS well positioned to benefit
2.5/3D Chiplet Technology | SUSS well positioned to benefit from the strong momentum in 2.5D and 3D evolution Temporary • HBM: Structural support during thinning Bonding • HBM: Stacking of DRAMs1 Hybrid • CPO: Stacking of PIC & EIC1 Bonding • SoIC: E.g., Logic-on-Logic1 HBM System on Integrated Chip
Slide 9: Higher accuracy & cleanliness in Backend
Higher accuracy & cleanliness in Backend | Rising performance demands push accuracy & cleanliness in Advanced Packaging toward Frontend standards Ongoing equipment enhance- ments & roll-out of new pro- Evolution of precision requirements in Advanced Packaging cesses & equipment required • Hybrid Bon
Slide 10: Efficient & green processes: Rising demand for ESG-compliant equipment
Efficient & green processes | Rising demand for ESG-compliant equipment Zero emissions growth by 2025, and achieving Product carbon footprint reduction net-zero emission across the value chain by 2050. from Cradle to Grave TSMC continuously minimizes resource consumption We work hand-in-hand with cu
Slide 11: Serviceable market is expected to grow by ~7% per annum through 2030
Serviceable market is expected to grow by ~7% per annum through 2030 Serviceable Available Market (Revenue in €M) Photomask • High-End mask market leading growth • Mid-End mask market growing mid-to high single Equipment digits annually CAGR: +7% Photomask Equipment • Market entry with MEMS, Power &
Slide 12: SUSS position in selected markets
SUSS position in selected markets #1 #2 New Market Leader First Follower Market Entry ~100% Full-field projection UV-Scanning ~20% Photomask Cleaning (Mid-end) - Hybrid Bonding >80% Photomask Cleaning (High-end) ~15% Spin Coating (excl. Frontend) - Inkjet ~65% Photomask Bake & Develop ~60% Mask Alig
Slide 13: Upcoming new product introductions – initiating next growth phase
Upcoming new product introductions – initiating next growth phase 2025 2026 2027 2028 2029 2030 Photomask Cleaning MaskTrack PRO/X CL MaskTrack SMART CL (High-End) Photomask Cleaning ASx 5500 ASx 9500 (Mid-End) Photomask GreenTrack-200 LVM Solutions GreenTrack GreenTrack-300 HVM (Wafer Cleaning) Gre
Slide 14: Growing Innovation
Growing Innovation
Slide 15: SUSS long term ambitions for 2030
SUSS long term ambitions for 2030 € 750 – 900 m 43 – 45% Sales Gross profit margin SUSS Ambition 2030 20 – 22% EBIT margin SUSS Ambition 2030 SUSS Ambition 2030 ~ 9 –13% annual sales growth compared to 2025e + ~9%-points EBIT margin expansion compared to 2025e + ~8%-points GP margin expansion compar
Slide 16: More diversified regional growth – with normalizing China share
More diversified regional growth – with normalizing China share 5% ~10% 6% ~15% 7% 34% ~15% Sales Sales 16% FY2024 FY2030 (as reported) (projected) ~10% ~30% 32% ~20% China Taiwan Korea EMEA Americas Rest of APAC (incl. Japan) Public I SUSS Capital Markets Day 2025 16
Slide 17: SUSS – a valued partner in the semi ecosystem
SUSS – a valued partner in the semi ecosystem – Working alongside leading chip companies, as well as key research and industrial partners Foundries Integrated Device Technology and Academia, and OSATs Manufacturers material partners consortia We have expanded (IDMs) and institutes our global standin
Slide 18: Strategic focus on Customer Service to grow revenue and margin
Strategic focus on Customer Service to grow revenue and margin We are increasing our sales share in service business from 18% to 25%, Service Portfolio which will lead to revenue growth in Customer centric service portfolio enabling our customers to concen- services to between €190m and €225m. trate
Slide 19: We are fully committed to drive the next chapter of innovation and growth
We are fully committed to drive the next chapter of innovation and growth in Frontend (Moore’s Law) and Backend (More than Moore) Heterogeneous integration creates new multi-chip modules Backend Innovation Frontend Innovation Striving for the next technology node Public I SUSS Capital Markets Day 20
Slide 20: Disclaimer
Disclaimer The following presentations contain forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec SE and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are there