Slide 1: Technology and Manufacturing
Technology and Manufacturing Fabio Gualandris President, Quality, Manufacturing, & Technology
Slide 2: Agenda
Agenda 1 Introduction 2 Manufacturing strategy 3 Technology strategy 4 Manufacturing reshaping 5 Takeaways
Slide 3: ST technology and manufacturing strategy is a key business enabler
ST technology and manufacturing strategy is a key business enabler In-house manufacturing ST in-house manufacturing complemented by partnerships • Agile and competitive footprint • Reliable supply chain for our customers • Product differentiation through proprietary technologies China Philippines Fr
Slide 4: High-volume manufacturing hubs
High-volume manufacturing hubs Front-end high-volume Back-end high-volume manufacturing hubs manufacturing hubs Agrate (Italy) Catania (Italy) Muar (Malaysia) Shenzhen (China) 300 mm Mixed Signal 200 mm SiC (Vertical integrated) Advanced leadframe China-for-China, Power Packages & Panel Level Packag
Slide 5: Manufacturing & technology competence centres
Manufacturing & technology Competence centres Front-end Back-end competence centres competence centres Front-end process development for advanced Agrate Agrate BCD and analog Grenoble Assembly R&D Shenzhen Front-end process development for power Singapore Catania technologies Grenoble Testing R&D Hi
Slide 6: Strategic manufacturing partnerships
Strategic manufacturing partnerships Model Collaboration model Front-end Back-end Collaboration with leading foundries and OSATs enables access to selected advanced technologies and geographical locations, complementing our Foundry OSAT portfolio and internal footprint 20% 35% Front-end TSMC: Leadin
Slide 7: Differentiated technologies are our foundation
Differentiated technologies are our foundation MEMS Smart Power: BCD for sensors & micro-actuators (Bipolar - CMOS - Power DMOS) FD-SOI CMOS Discrete, Power MOSFET, IGBT FinFET through Foundry Silicon Carbide, Gallium Nitride Analog & RF CMOS Vertical Intelligent Power Silicon photonics eNVM CMOS Op
Slide 8: Our proprietary front-end technologies enable product differentiation
Our proprietary front-end technologies enable product differentiation 3D stacked sensors (RGB BCD Auto – BCD GaN Specialized optical Smart Power and infrared) Galvanic Isolation sensing processes Planar optical elements Power SiC (known good 55 nm BiCMOS SiC multi-generation RF CMOS & BiCMOS dice, D
Slide 9: Packaging technology roadmap
Packaging technology roadmap Power IPM Molded module Embedded interconnect Power module Power box Potted module Immersion cooling Power density Reliability TOxxx HU3Pak Top side cooling Cooling efficiency Power discrete STPak Hi creepage > 1200V Diffusion soldering QFP PSSO QFN Leadframe Heterogenou
Slide 10: Chiplet: a new scalable, innovative, efficient way to approach integration
Chiplet: a new scalable, innovative, efficient way to approach integration Monolithic design Chiplet design System in System on chip (SoC) package (SiP) Chiplet enablers Status and planning Chip modular design maximizing technology performance Strategic initiative: dedicated R&D center to cover devi
Slide 11: 18 nm FD-SOI Phase Change Memory (PCM) technology breakthrough for MCUs
18 nm FD-SOI Phase Change Memory (PCM) Technology breakthrough for MCUs FBB Competitive advantages Outstanding energy efficiency through FD-SOI body biasing capability Total dielectric isolation No channel doping Robust embedded non-volatile memory (eNVM) qualified in automotive No pocket implant Ad
Slide 12: Panel level packaging in volume production in ST today
Panel level packaging in volume production in ST today A first of a kind Panel mold Plating process • Producing 4+ million units per day in internal manufacturing line - First line in the world Full lights-out Lithography manufacturing
Slide 13: Strategic manufacturing programs update
Strategic manufacturing programs update Leveraging 300 mm investments Leveraging Silicon Carbide investments Crolles Catania High-volume manufacturing for advanced CMOS nodes and Fully vertically integrated high-volume 200 mm campus optical products. Capacity up to 20 kwpw* Capacity up to 15 kwpw* A
Slide 14: Manufacturing reshaping
Manufacturing reshaping Crolles Agrate Catania Chongqing (Sanan JV) 2024 2027-2028 2024 2027-2028 150 mm 200 mm 300 mm 40% 54% >2x 200 mm 200 mm 150 mm 200 mm wafer size equivalent normalized at 25 mask level
Slide 15: Agrate 300 mm fab evolution
Agrate 300 mm fab evolution Status and planning Line fully qualified, move to production Capacity growth tailored to demand Advanced BCD, HCMOS for personal electronics, automotive 300 mm competence centre synergy Seamless interoperability Twin fabs Agrate and Crolles 300 mm Roadmaps Analog mixed si
Slide 16: Crolles 300 mm fab evolution
Crolles 300 mm fab evolution Status and planning State-of-the-art production line with modular facilities and capacity approach 20% capacity output increase by H2 2026 Advanced device technology for imaging Integration of 18 nm FD-SOI with ePCM technology for automotive, industrial, and consumer ele
Slide 17: SiC manufacturing ecosystem
SiC manufacturing ecosystem • ST SiC leadership leverages a multi-site manufacturing network Catania SiC raw substrate supply mainly from Catania and Sanan Wafer processing in Catania, in Chongqing JV, Singapore Technology Hub Shenzhen Testing and assembly in Catania and in Shenzhen expanded campus
Slide 18: First of a kind for mass production of 200 mm SiC devices
First of a kind for mass production of 200 mm SiC devices Fully vertically integrated: ingot growth, wafering, epitaxial growth, front-end wafer fabrication, test, packaging, KGD, module assembly Scale and synergies enabling innovation in high-volume manufacturing capacity, leveraging full automated
Slide 19: Catania SiC Campus progressing for start of production in 2025
Catania SiC Campus Progressing for start of production in 2025 Status and planning Q4 2024: 200 mm SiC line qualified (mini-line) High-volume manufacturing tools installation in progress, production start by Q4 2025 Designed for an extensive use of robots, AI-based manufacturing processes, machine l
Slide 20: China-for-China operating model to support domestic China growth
China-for-China operating model to support domestic China growth Operate locally to support fast-changing and highly-competitive Shenzhen China market Back-end assembly & test Chongqing Fully localized, scalable integrated device manufacturing SiC Front-end manufacturing Front-end manufacturing for
Slide 21: Manufacturing and technology – Takeaways
Manufacturing and technology – Takeaways Accelerating the reshaping of our silicon manufacturing footprint Focus on Crolles and Agrate 300 mm high-volume manufacturing fabs Rebalance 200 mm capacity Concentrate 150 mm silicon based legacy products in Singapore Silicon carbide manufacturing ecosystem
Slide 22: Find out more at www.st.com
Find out more at www.st.com © STMicroelectronics - All rights reserved. ST logo is a trademark or a registered trademark of STMicroelectronics International NV or its affiliates in the EU and/or other countries. www.st.com/trademarks For additional information about ST trademarks, please refer to ww