ASML Holding NV · EURONEXT:ASML
ASML Holding NV — UBS Technology Conference 2010
19 slides from ASML Holding NV's conference presentation, Mar 11, 2010
Slide 1: UBS Technology Conference 2010
UBS Technology Conference 2010 Franki D’Hoore Director European Investor Relations March 11, 2010
Slide 2: ASML: Leading supplier in lithography equipment
ASML : Leading supplier in lithography equipment Headquarters: Veldhoven, The Netherlands Market cap ~ € 10 B Employees ~ 6500 Slide 2 |
Slide 3: ASML market share development
ASML market share development 8,000 80% 7,000 70% WW M$ 6,000 60% ASML Revenue Market Share [%] ASML market share World Wide Market [M USD] 5,000 50% 4,000 40% 3,000 30% 2,000 20% 1,000 10% 0 0% 1990 2000 1991 1994 1995 1999 2003 1981 1985 1988 1992 1993 1996 1997 1998 2001 2002 2004 2005 2006 2007
Slide 4: ASML Total net sales M€
ASML Total net sales M€ 4500 ASML 4000 3,768 guidance for 3,582 Q1 and Q2 3500 955 1053 2,954 3000 2,529 494 Q4 Net sales 2,465 2500 Q3 934 548 785 697 2000 958 Q2 1,543 533 1,596 1500 Q1 611 930 844 526 581 942 950 1000 763 370 616 555 500 329 949 919 685 629 277 700 318 453 183 0 2003 2004 2005 20
Slide 5: Chip makers shrinks continue
Chip makers shrinks continue Average of multiple customers’ input 200 248 nm DRAM Logic NAND Flash (working memory (microprocessors, (special memory, in PC’s) the “brains” used in, for example of PC’s) mp3 players) Resolution, "Shrink" (nm) 100 80 193 nm 60 50 40 Technology transitions 30 20 EUV 13.
Slide 6: R&D spend supports continued technology leadership
R&D spend supports continued technology leadership ASML R&D investment (excl. Zeiss for lenses) 4000 550 500 3500 450 3000 400 R&D Investment (M€) Total Sales (M€) 2500 350 300 2000 250 1500 200 1000 150 100 500 50 0 0 1992 1994 1996 1998 2000 2002 2004 2006 2008 Total sales M€ R&D investment M€ Sou
Slide 7: ASML: #2 in European R&D per employee
ASML: #2 in European R&D per employee Company (market cap > €2.5 bln) R&D per employee (€) Shire (pharma) 98,100 ASML (semiconductors) 78,000 Porsche (automotive) 74,900 UCB (pharma) 67,900 Lundbeck (pharma) 57,600 AstraZeneca (pharma) 54,800 Autonomy (software) 51,600 Sanofi-Aventis (pharma) 46,900
Slide 8: R&D focus on major strategic programs
R&D focus on 3 major strategic programs TWINSCAN NXT Holistic Lithography EUV Slide 8 |
Slide 9: Immersion and EUV Technology Leadership
Immersion and EUV Technology Leadership Immersion Lithography Leader Installed Base >160 Systems at 22 Customers, across all sectors NXT:1950i EUV for 22nm and beyond 6 systems shipping thru mid 2011 NXE:3100 Source: ASML Slide 9 |
Slide 10: Holistic Litho
Holistic Litho To keep process in application specific window center using computational lithography, cost effective metrology and feedback loops Scanner settings Data design/ SMO Scanner Wafer data mask data FlexRay settings BaseLiner Control Tuning Wafer data Scanner settings Data Scanner settings
Slide 11: Backlog: value and litho units
Backlog: value and litho units Backlog value Systems 2500 300 ASP ASP ASP €10.3M €14.8M €26.8M 250 2000 ASP Backlog value M€ Backlog units ASP €18.75M 200 1500 €12.5M 150 ASP 1000 €11M 100 500 50 0 0 Jan 03 Jan 04 Jan 05 Jan 06 Jan 07 Jan 08 Jan 09 Jan 10 Jul 03 Jul 04 Jul 05 Jul 06 Jul 07 Jul 08 Ju
Slide 12: Leading Edge Memory Drives Backlog
Leading Edge Memory Drives Backlog Total value M€ 1,853 Technology NXT 17 systems or KrF 8% ~40% of ArF dry 1% immersion backlog ArF Region immersion End-use 91% USA NAND 18% Japan 17% IDM Taiwan 13% 15% 27% Singapore 7% Foundry Korea Europe 4% DRAM 13% 31% 56% Numbers have been rounded for readers’
Slide 13: Memory capacity expected to be tight in 2010
Due to 200 mm fab retirement, memory capacity is expected to be tight in 2010 Memory WW Wafer Output Split by Node [1Q07 - 4Q10] 2600 6x & 5x Estimate 30 & f Conversion 0m ab 2400 m clo Immersion for 5x, 4x ut s u ilis re 2200 & 3x conversion at s Starts / Month [300mm equiv. KWspM] d io Ad n 2000 i
Slide 14: DRAM bit sufficiency analysis
DRAM DRAM bit sufficiency analysis: At 47% bit demand growth market slightly under-supplied during 2010 DRAM Sufficiency Model: ASML's fcst-based Supply versus Gartner-based Demand 700 140% ASML Modeled DRAM bit supply [Mio. GB] Gartner Forecast DRAM bit demand [Mio. GB] 600 DRAM Sufficiency (ASML)
Slide 15: NAND bit sufficiency analysis
NAND NAND bit sufficiency analysis: At 70% bit demand growth market is well balanced for 2010 NAND Sufficiency Model: ASML's fcst-based Supply versus Gartner-based Demand 4,000 160% ASML Modeled NAND bit supply [Mio. GB] Gartner Forecast NAND bit demand [Mio. GB] 3,500 140% NAND Sufficiency (ASML) 3
Slide 16: Memory Growth Summary
Memory Growth Summary DRAM • In 2010 DRAM bit demand growth can be met by shrink towards 45 nm node requiring investments in immersion machines only • Forecasted 2011 bit demand must be met with wafer capacity additions i.e. new wafer fabrication facilities requiring Immersion/ArF/KrF and i-line too
Slide 17: ASML Systems: 300mm Memory
ASML Systems: 300mm Memory Average number of systems required for new fab 3xnm NAND 4xnm DRAM ArFi ArF KrF KrF I-Line ArFi ArF KrF KrF I-Line ArFi ArF KrF KrF I-Line ArFi ArF KrF KrF I-Line ArFi KrF KrF I-Line ArFi ArF KrF KrF I-Line ArFi KrF KrF I-Line ArFi ArF KrF KrF I-Line ArFi KrF KrF I-Line Ar
Slide 18: ASML Systems: 300mm Logic Fab
ASML Systems: 300mm Logic Fab Average number of systems required for new fab 4xnm Logic ArFi KrF KrF I-Line ArFi KrF KrF ArFi KrF KrF ArFi KrF KrF ArFi KrF KrF ArFi ArFi ArFi ArFi 39 litho layers 45k wafers/month All scenarios are based on “typical” process using 2009 XT system productivity levels .
Slide 19: Summary
Summary • ASML has gained required scale through market gains supporting required litho R&D investments • ASML is leading in meeting the industry's shrink roadmaps • Memory supply/demand close to balance in 2010. Bits growth supplied by shrink only • Further memory bit supply growth in near future w