Canon Inc. · TSE:7751
Canon — 2025 Corporate Strategy Conference
13 slides from Canon's conference presentation, Mar 7, 2025
Slide 1: Industrial Group
Canon Inc. 2025 Corporate Strategy Conference Industrial Group March 7, 2025 Hiroaki Takeishi Senior Managing Director Head of Industrial Group This presentation contains forward-looking statements with respect to future results, performance and achievements that are subject to risk and uncertaintie
Slide 2: Industrial Group Consolidated Performance
Performance Outlook Industrial Group Consolidated Performance （Billions of yen） Net sales Op. profit Op. profit ratio 600 40% 35% 500 Net sales/Op. profit Op. profit ratio 424.2 30% 400 356.5 337.7 329.2 314.7 25% 19% 19% 300 18% 18% 20% 13% 15% 200 10% 100 58.0 58.6 68.9 76.3 44.9 5% 0 0% 2020 2021
Slide 3: Semiconductor and Display Market Trend
Semiconductor and Display Market Trend US＄B Semiconductor Market M [Units] Display Market 1,000 3,500 900 O-S-D 3,000 800 OLED 700 Analog 2,500 600 2,000 Logic 500 1,500 400 Micro 300 1,000 LCD 200 Memory 500 100 0 0 2023 2024 2025 2026 2023 2024 2025 2026 Note: O-S-D Optical Sensor Discrete Device
Slide 4: Results & Challenges up to 2024 and Strategies & Measures
Results & Challenges up to 2024 and Strategies & Measures Results up to 2024 & Challenges • Rolled out competitive products into robust semiconductor market and achieved significant increase in unit sales • In addition to nanoimprint, launched products for leading-edge device market, such as 3D pack
Slide 5: Business Strategy
Business Strategy ◼ Expand in scale, scope, and application of semiconductor manufacturing ◼ Raise competitiveness of manufacturing equipment for OLED displays ◼ Strengthen and expand data solutions business ◼ Cultivate new business domains through integration of core technologies 4
Slide 6: Canon Semiconductor Manufacturing Equipment Line-up
Canon Semiconductor Manufacturing Equipment Line-up 5
Slide 7: Expand Scale, Scope, and Application of Semiconductor Manufacturing
Expand Scale, Scope, and Application of Semiconductor Manufacturing More Moore：Miniaturization More than Moore：Diversification Logic CPU Memory Image sensor RF/MEMS Power/LED Packaging Nanoimprint Semiconductor Manufacturing Equip. ArF Litho. Equip Litho. Equip. for PLP High Productivity KrF Litho.
Slide 8: Evolution of Semiconductor Devices (Three Trends)
Evolution of Semiconductor Devices (Three Trends) Advanced 3D Packaging Structuring CBA CPO BS-PDN Advanced Patterning Chiplet FinFET GAA NS Forksheet Semiconductor devices continue to evolve in both More-Moore and More-than-Moore Three major trends: Advanced Patterning, 3D Structuring, and Advanced
Slide 9: Advanced Patterning: Nanoimprint Lithography Technology
1) Advanced Patterning: Nanoimprint Lithography Technology ◼Form fine and clear circuit pattern of around 10nm using a simple stamp principle Next-generation Logic DRAM AI chip 3D-NAND Move to development CoO and TAT reduction in Verifies manufacturing of Introduced Canon photo phase for use in 2nm
Slide 10: Advanced Patterning: Development of ArF Lithography Equipment
1) Advanced Patterning: Development of ArF Lithography Equipment ArF Lithography Equipment 65nm L/S pattern results FPA-6300AS6（under development） 65nm resolution was achieved using newly developed projection lens Lighting mode NA0.93, 4/5Annular Shot shape correction capability Conventional ArF New
Slide 11: 3D Structuring: Wafer Bonding Equipment
2) 3D Structuring： Wafer Bonding Equipment Compound CIS BS-PDN CBA CFET Semiconductor Atomic Diffusion Bonding Equipment BC7300 Vacuum Thin film deposition Wafer flip and Wafer bonding （Spattering） contact Wafer A Wafer B Provides 3D integrated solutions for various devices with technology for bondi
Slide 12: Advanced Packaging: Addressing Larger Package Sizes
3) Advanced Packaging: Addressing Larger Package Sizes Current: x2 Soon: x3.3 Future: x4 Lithography Equipment for WLP Lithography Equipment for PLP FPA-5520iV LF2 FPA-8000iW 0.8 µm resolution across a 52mm × 68mm single- i-line stepper for packaging of large square exposure field (Current x4) subst
Slide 13: Enhance Production Capacity with New Facility at Utsunomiya site
Enhance Production Capacity with New Facility at Utsunomiya site Semiconductor Lithography 308 New factory image Equipment unit sales 233 176 187 140 122 84 2019 2020 2021 2022 2023 2024 2025 Concept of new factory Automation On-site logistics, skilled work Optimization Centralized management of pro