Slide 1: 2023 Investor Conference
Solid State System (3S) 鑫創科技：3259 2023 Investor Conference 2023/12/19
Slide 2: Agenda
Agenda Company Introduction Business Overview Q&A
Slide 3: Safe Harbor Statement
Safe Harbor Statement Except for historical information contained herein, the matters set forth in this presentation are forward looking statements that are subject to risks and uncertainties that could cause actual results to differ materially, including the impact of competitive products and prici
Slide 4: Agenda: Company Introduction
Agenda Company Introduction Business Overview Q&A
Slide 5: 3S Company Profile
3S Company Profile • Company Name : Solid State System Co., Ltd. • Establish : Nov. 1998 • Chairman : Jeffrey Lin • IPO Date : Dec. 2007 (TPEX: 3259) • Headquarters : Tai Yuen Hi-Tech Industrial Park, Hsinchu, Taiwan • Other Offices : Shenzhen China • Employees : 120
Slide 6: NAND Flash Controller IC
NAND Flash Controller IC USB 3.2 Gen I Ctr. IC SSD Solution 6
Slide 7: 3S Advantages for NAND Flash Controller
3S Advantages for NAND Flash Controller • 25-year experience and record in delivering NAND flash controller turn-key solution from SLC, MLC, TLC to 3D NAND TLC, QLC. • NAND flash knowhow in-depth. The only one NAND controller maker who had developed NAND interface SONOS cell flash memory. • Broad ex
Slide 8: USB Audio IC
USB AUDIO IC Product Type with USB AUDIO IC 8
Slide 9: 3S Advantages for USB Audio Controller
3S Advantages for USB Audio Controller 14-year experience and record in delivering USB Audio Controller. Audio knowhow in-depth with Application Software Support. Dedicated FAE at Shenzhen Office for Quick Customer Support. 9
Slide 10: MEMS Mic Product Features
MEMS Mic Product Features • R&D Strength: A complete MEMS Mic R&D team including Sensor, ASIC and Package technology. With 30+ years experience, masters the key know-how and knowledge in MEMS structure, mix mode circuits and acoustic characteristics. • Patent Protection : Patents cover from chip, pa
Slide 11: All Series MEMS Microphone Provider – 3S
All Series MEMS Microphone Provider – 3S A Complete MEMS Mic R&D Team High Product Consistency Sensor R&D Dept. Cooperate Reasonable to solve allocation of technical resources issues ASIC Packaging Tolerance R&D ~±0.25 dB Technology Dept. Dept. Comprehensive consideration of goals and limitations 11
Slide 12: All Series MEMS Microphone Provider – 3S
All Series MEMS Microphone Provider – 3S SENSOR ASIC Sensor Types ASIC Types Product Decay Low Flat Low Analog Analog Frequency Frequency High SNR diversity Response Response Single-Ended Differential Interface Interface Features Analog High meet Resistant Anti-light Digital Single-Ended application
Slide 13: MEMS-High specification product progress
MEMS-High specification product progress Series Product SPM 4737 Bottom Port Analog MEMS Microphone SNR 70dB (2023/Q1 MP) SPA 3325 Bottom Port Differential Interface SNR 65dB (2022/Q4 MP) SPG 4020 Top Port SPH 3526 Bottom Port Digital MEMS Microphone SNR 67dB SNR 67dB (2024/Q1 Sample) (2024/Q1 Sampl
Slide 14: 3S Patent Introduction
3S Patent Introduction • Own IP, Own IC, Own Patents • 3S MEMS patent differs from Knowles 3S’ patented Knowles’ patented Wafer Package MEMS structure MEMS structure More than 100 items US08093119B2 US06535460B2 MEMS microphone own patents over the United States, China and Taiwan Other (ex. Test, Tr
Slide 15: 3S Field of Product Application
3S Field of Product Application 3S Product Application Mobile Hearing Headset Notebook Automotive Mic Array Phone Aids Audio Smart Conference Speaker Talking ANC Smart TV Smart Home ENC AI Detection 15
Slide 16: Main Customer
Main Customer iSKYWORTH KT'C ANKER Cig ABB manne $3 G im?) Japan : EZVIZBS fit 52 wae 1 1 S -- @ rm I j a 2028222 Sé6 || we Ee nsise GEELY DFSK CHERY gegiszy ASS pas suactan : bee ee ee ee. I DAIHATSU 1 Panasonic , @audiotechnica.| ) , wy HARMAN > | MASTER & DYNAMIC
Slide 17: Agenda: Business Overview
Agenda Company Introduction Business Overview Q&A
Slide 18: Consolidated Balance Sheet
Consolidated Balance Sheet NT$K 2020 2021 2022 2023Q3 Current Assets 359,630 596,135 518,842 394,163 Cash and Cash Equivalents 94,242 171,771 65,952 43,901 Accounts Receivable 63,054 80,417 54,234 34,884 Inventory 191,348 334,848 390,453 299,047 Other Current Assets 10,986 9,099 8,203 16,331 Non-cur
Slide 19: Consolidated Statements of Comprehensive Income
Consolidated Statements of Comprehensive Income NT$K 2020 2021 2022 2023Q3 Sales 650,504 692,352 402,605 221,159 Gross Profit 146,116 229,488 116,429 33,463 Gross margin(%) 22 33 29 15 Selling Expenses 77,008 65,500 67,713 46,046 G&A Expenses 39,198 31,670 35,932 32,167 R&D Expenses 170,205 135,756
Slide 20: Revenue by Product
Revenue by Product 800,000 6% 600,000 8% 44% 49% 4% 400,000 30% 13% 200,000 48% 45% 66% 45% - 42% 2020 2021 2022 2023Q3 NAND Flash Controller IC Audio IC Technical service
Slide 21: Future Prospect
Future Prospect • Continue developing NAND Flash Controller and value-add application solutions. • Expanding MEMS Mic market share and enter high performance oriented main stream market. • Continue developing Audio IC products to secure existing market and customers, and expanding applications.
Slide 22: Thank You
Thank You www. 3system.com.tw <> Solid State System