Technoprobe Spa · MIL:TPRO
Technoprobe Spa — Investor Presentation (May 2025)
42 slides from Technoprobe Spa's investor presentation, May 2025
Slide 1: Technoprobe S.p.A.
LAAs Technoprobe S.p.A. May 2025 ‘S) TECHNOPROBE
Slide 2: Disclaimer
Disclaimer This document has been prepared by Technoprobe S.p.A. (the “Company”) solely for use in the presentation. This document does not constitute or form part of any offer or invitation to sell, or any solicitation to purchase any security issued by the Company. The information contained and th
Slide 3: Innovation begins with us
Innovation begins with us A leading company in the field of semiconductors and microelectronics INNOVATION BEGINS WITH US
Slide 4: Company Overview
Company Overview Revenue Ebitda Net Income Net Financial Position Mkt Cap 2024 Key financial metrics €543.2m €136.5m €62.8m €656.3m ~€4,6bln +22% 25% 12% as at as at CAGR 19-24 EBITDA margin on revenues 31/12/2024 20/5/2025 Shareholding Structure Leading player in designing and manufacturing of prob
Slide 5: Where we are
Where we are 3 Continents 10 Countries 23 Legal entities INNOVATION BEGINS WITH US 5
Slide 6: What we do
What we do Technoprobe operates both at wafer-level and in final testing INNOVATION BEGINS WITH US 6
Slide 7: The Probe Card
The Probe Card 7
Slide 8: The Probe Card
The Probe Card Mechanics PCB Interconnection Ceramic plates Probe Head Contact probes 8
Slide 9: The Probe Card
The Probe Card The Probe Card has very thin needles (probes) that touch the terminals (pads) of chips, thus electrically connecting to a tester. 9
Slide 10: The Probe Card
The Probe Card The Probe Card has very thin needles (probes) that touch the terminals (pads) of chips, thus electrically connecting to a tester. Probe Card Wafer 10
Slide 11: Reference Market
Reference Market INNOVATION BEGINS WITH US
Slide 12: Overview of the Semiconductor Probe Cards market
Overview of the Semiconductor Probe Cards market 2024 Non-memory applications 2024 Semiconductor Probe Cards Market* market share Overall market value: $2.4bn Memory applications $805m Non memory applications $1.638m *Source: Yole – Semiconductor Test Consumables market monitor Q3 2024 (Sept.2024) –
Slide 13: Overview of the Semiconductor Probe Cards market
Overview of the Semiconductor Probe Cards market 2024 Vertical MEMS Probe Cards 2024 Non-Memory applications by type* market share Other Advanced Vertical Probes $194m Cards $286m Epoxy/Cantilever $222m Vertical MEMS probes Cards $937m Source: Yole – Semiconductor Test Consumables market monitor Q3
Slide 14: Probe Cards in the semiconductor manufacturing process
Probe Cards in the semiconductor manufacturing process INNOVATION BEGINS WITH US 14 14
Slide 15: Our positioning in the testing space
Our positioning in the testing space FRONT END BACK END Wafer fabrication Wafer Testing Assembly Final Testing & pre-assembly Wafer dicing Level & Packaging Level preparation Wafer Level Socket Singulated Die System Level Testing Advanced Packaging Device Interface Board Probe Card INNOVATION BEGINS
Slide 16: Business Model
Business Model INNOVATION BEGINS WITH US
Slide 17: A successful and vertically integrated business model
A successful and vertically integrated business model INNOVATION BEGINS WITH US 17 17
Slide 18: Built an open eco-system partnerships
Built an open eco-system partnerships Accelerate growth of Priority suppliers complete Probe Card and of PCB Final Test Interfaces by acquisition of DIS Joint Development Projects Joint Development Projects to deliver superior customer to share knowledge value in SOC and Memory
Slide 19: Overview of the Probe Cards manufacturing process
Overview of the Probe Cards manufacturing process INNOVATION BEGINS WITH US 19 19
Slide 20: A wide range of highly innovative technologies
A wide range of highly innovative technologies INNOVATION BEGINS WITH US 20
Slide 21: Vision & Strategy
Vision & Strategy INNOVATION BEGINS WITH US
Slide 22: Challenges & strategic setting
Challenges & strategic setting Evolution of chip technology → Continuous investments in R&D 1 (more than Moore) Scaling slow down as enabler for chiplets, → M&A as accelerator of 3D architectures and new materials technological development → Strategic partnerships Increase in complexity 2 Design and
Slide 23: What’s next?
What’s next? FRONT END BACK END Wafer Testing Level Final Testing Level Probe Card Device Interface Board INNOVATION BEGINS WITH US 23
Slide 24: What’s next?
What’s next? Consolidate the leading positioning in all test segments FRONT END Drive advancements in Logic Semiconductor Testing Proliferate high-speed, high-voltage, radio frequency and silicon photonics Enter the High Bandwidth Memory (HBM) segment BACK END Strengthen positioning in Final Testing
Slide 25: Semiconductor technology trends
Semiconductor technology trends FRONT END Drive advancements in Logic Semiconductor Testing INNOVATION BEGINS WITH US 25
Slide 26: Semiconductor technology trends
Semiconductor technology trends FRONT END Drive advancements in Logic Semiconductor Testing INNOVATION BEGINS WITH US 26
Slide 27: Semiconductor technology trends
Semiconductor technology trends FRONT END Drive advancements in Logic Semiconductor Testing INNOVATION BEGINS WITH US 27
Slide 28: Advanced packaging versus standard
Advanced packaging versus standard FRONT END Drive advancements in Logic Semiconductor Testing INNOVATION BEGINS WITH US 28
Slide 29: Advanced packaging versus standard
Advanced packaging versus standard FRONT END Drive advancements in Logic Semiconductor Testing INNOVATION BEGINS WITH US 29
Slide 30: Technoprobe as advanced packaging enabler
Technoprobe as advanced packaging enabler FRONT END Drive advancements in Logic Semiconductor Testing INNOVATION BEGINS WITH US 30
Slide 31: A hungry world of wideband applications
A hungry world of wideband applications FRONT END Proliferate high-speed, high-voltage, radio frequency and silicon photonics INNOVATION BEGINS WITH US 31
Slide 32: A hungry world of wideband applications
A hungry world of wideband applications Proliferation of connections Bandwidth - hungry applications Increasing reliance on the cloud FRONT END Proliferate high-speed, high-voltage, radio frequency and silicon photonics INNOVATION BEGINS WITH US 32
Slide 33: A hungry world of wideband applications
A hungry world of wideband applications Future demands on the network will be driven by a combination of factors: Silicon photonics Technoprobe technologies integrated in the same product enable… Fine pitch probing → alignment with advanced packaging roadmap Radio frequency probes → high-speed perfo
Slide 34: DRAM & HBM: complexity as driver to new products
DRAM & HBM: complexity as driver to new products FRONT END Enter the High Bandwidth Memory (HBM) segment INNOVATION BEGINS WITH US 34
Slide 35: DRAM & HBM: complexity as driver to new products
DRAM & HBM: complexity as driver to new products FRONT END Enter the High Bandwidth Memory (HBM) segment INNOVATION BEGINS WITH US 35
Slide 36: DRAM & HBM: complexity as driver to new products
DRAM & HBM: complexity as driver to new products We have applied the disaggregation to test interface hardware Main motherboard Best technology: printed circuit board (PCB) Device substrate Best technology: high density interconnect (HDI) Probe substrate Best technology: multi-layer organic (MLO) BA
Slide 37: Growth drivers & trajectories
Growth drivers & trajectories INNOVATION BEGINS WITH US 37
Slide 38: Financial Outlook
Financial Outlook INNOVATION BEGINS WITH US
Slide 39: Mid-terms scenario
Mid-terms scenario INNOVATION BEGINS WITH US 39
Slide 40: Market trends & revenues path
Market trends & revenues path INNOVATION BEGINS WITH US 40
Slide 41: Profitability profile
Profitability profile INNOVATION BEGINS WITH US 41
Slide 42: Capex
Capex INNOVATION BEGINS WITH US 42