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TI's EMI-optimized integrated transformer technology miniaturizes isolated power transfer into IC-sized packaging
Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated
About this update from Texas Instruments Incorporated
[{"type":"text","content":"Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated DC/DC bias power supply\n\n\nDALLAS, Feb. 11, 2020 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today introduced the first integrated circuit (IC) developed with a new proprietary integrated transformer technology: a 500-mW high-efficiency isolated DC/DC converter with the industry's lowest electromagnetic interference (EMI), the UCC12050. Its 2.65-mm height enables designers to reduce their solution volume by as much as 80% compared to discrete solutions and 60% compared to power modules – with twice the efficiency of competing devices. Built for industrial performance, the UCC12050's 5-kVrms reinforced isolation and 1.2-kVrms working voltage protect against high-voltage spikes in systems such as industrial transport, grid infrastructure and medical equipment. For more information, see www.ti.com/UCC12050-pr.\n\n \n \n\n \nTI's breakthrough integrated transformer technology enables high-density isolated DC/DC power conversion, while maintaining low EMI. The single-package, surface-mount architecture gives designers an easy-to-use, low-profile IC that reduces the bill of materials (BOM), and efficiently operates across a wide temperature range. An EMI-optimized, low capacitance transformer and quiet control scheme streamline EMI compliance while providing a reliable solution with options for reinforced or basic isolation. Download the white paper, \"Power Through the Isolation Barrier: The Landscape of Isolated DC/DC Bias Power Supplies\" to learn more about this new family of reinforced isolated DC/DC bias supplies. \nTI will demonstrate the UCC12050 in booth No. 1001 at the Applied Power Electronics Conference (APEC) in New Orleans, Louisiana, March 15-19, 2020.\nKey features and benefits of the UCC12050\nSmall size, increased power density: Available in a 16-pin small-outline integrated circuit (SOIC) package measuring 10.3 mm by 10.3 mm by 2.65 mm, the UCC12050 offers 60% efficiency – twice that of competing devices of similar size – and twice the power density of comparative isolated power modules. Delivering 0.5 W in the new architecture improves reliability, enables a small BOM and simplifies board layout. Ultra-low EMI: The UCC12050's integrated transformer ...