Press release
Chicony Power and TI join forces to bring GaN technology to next-generation energy-efficient laptop power adapter
Chicony Power achieved high power density and up to 94% efficiency in their latest laptop power adapter design backed by TI's dual-chip GaN active clamp
About this update from Texas Instruments Incorporated
[{"type":"text","content":"Chicony Power achieved high power density and up to 94% efficiency in their latest laptop power adapter design backed by TI's dual-chip GaN active clamp flyback solution\n\n\nDALLAS, Dec. 14, 2022 /PRNewswire/ -- Texas Instruments (TI) (NASDAQ: TXN), a leader in high-voltage semiconductor solutions, today announced that Chicony Power designed in TI's integrated gallium nitride (GaN) technology to power its latest 65-W laptop power adapter, Le Petit. Leveraging TI's half-bridge GaN FET with integrated gate driver, LMG2610, Chicony Power and TI collaborated on a design to reduce the size of Chicony's power adapter by 50% and increase efficiency up to 94%.\nAs a leading power supply provider committed to improving power conversion efficiency in electronic power designs, Chicony Power has worked closely with international IC companies, providing them with market and technical requirements to help develop solutions in new designs. For the Le Petit laptop adapter design, Chicony Power teamed up with TI for its expertise in high-voltage design and its integrated GaN technology. TI's LMG2610 is designed to be paired with the UCC28782 active clamp flyback (ACF) controller to create an easy-to-use, high-efficiency, and high-power-density solution for AC/DC designs under 75 W.\nImproving power conversion efficiency Increasingly, consumers seek smaller, lighter electronics while also wanting to reduce their energy footprint. In the laptop power adapter market, this has challenged engineers to find new ways to pack more power in smaller spaces while minimizing power loss to deliver more efficient adapters.\nChicony Power and TI were able to miniaturize the power adapter design and lower the use of mechanical materials by 40% by leveraging TI's LMG2610 GaN FET, which integrates upper and lower switches, gate driver IC, level shifter and bootstrap circuits on a single chip, as well as Chicony Power's 3D structure, component miniaturization, heat dissipation system and electromagnetic interference (EMI) suppression design expertise. Le Petit has a compact size of 49 cm3, slightly larger than a typical ice cube, with a power supply conversion efficiency as high as 94% compared to the 89% efficiency achieved by typical power adapters using silicon materials.\n\"Our collaboration with Chicony Power is an example of how TI's products help make elec...