Press release
Teradyne & Enflame Collaborate to Ensure Thorough Testing of AI Devices for Data Center Training
NORTH READING, Mass. and SHANGHAI, China, Dec. 20, 2019 (GLOBE NEWSWIRE) -- Teradyne, Inc. (NASDAQ: TER), a leader in semiconductor automated test solutions,
About this update from Teradyne, Inc.
[{"type":"text","content":"NORTH READING, Mass. and SHANGHAI, China, Dec. 20, 2019 (GLOBE NEWSWIRE) -- Teradyne, Inc. (NASDAQ: TER), a leader in semiconductor automated test solutions, and Enflame Technology today announced that Enflame’s Deep Thinking Unit (DTU), designed to accelerate deep learning deployment for data center training, is supported by Teradyne’s UltraFLEX test system.\n Enflame’s DTU is based on a reconfigurable architecture that is optimized for the high performance computing and power efficiency required for deployment in major machine learning frameworks. In order to test this new architecture, Enflame needed a test system that can handle very high current – greater than 300A at low voltage device power. UltraFLEX provides the required current with high accuracy and stability that Enflame needs, along with the current profiling software and measurement resolution needed for engineers to dynamically observe current during device testing. The integration of multiple advanced IP blocks within Enflame’s DTU demands a device bring-up software toolset that is highly flexible, designer-friendly and fully integrated into the tester software environment. UltraFLEX’s Protocol Aware meets all of the requirements and significantly helped Enflame to accelerate the debug schedule. Teradyne’s award-winning IG-XL Software enables Enflame to collaborate and modularize test program development, reducing program development and debugging time. “Teradyne’s UltraFLEX has played a critical role in our first AI training product launch,” said Bob Deng, Senior Design Engineering Director, Enflame. “Thanks to Teradyne and the UltraFLEX platform, we were able to significantly accelerate our test and debug schedule and meet our quality commitments. Best-In-Class test quality is very important to our success and we are pleased with the powerful test solution Teradyne provides.” “The market for AI chips is very competitive and time sensitive,” said Regan Mills, Vice President of SOC Marketing at Teradyne. “The design complexity and device power requirements make device bring-up and volume production a significant challenge. For AI startup companies like Enflame, achieving the fastest time to market with best quality is crucial and with the UltraFLEX our customers can reliably meet device capability and schedule requirements. Teradyne’s partnership with Enflame is ...