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Tundra's SLE Division Announces Market's First 150 Gb/s Interlaken IP Core
Silicon Logic Engineering Launches High Performance Interlaken Interconnect Protocol Core EAU CLA...
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[{"type":"text","content":"\n\n\n\nSilicon Logic Engineering Launches High Performance Interlaken\n\n\nInterconnect Protocol Core\n\n\nEAU CLAIRE, WI, Feb. 27 /CNW Telbec/ - Silicon Logic Engineering Inc.\n(SLE), a high-end semiconductor design services division of Tundra\nSemiconductor Corporation, today announced the availability of a new 150Gb/s\nhigh speed Interlaken protocol IP core for use in ASIC designs.\n\n\nSLE's new Interlaken IP Core is now available with more than twice the\nperformance of the standard 60Gb/s version. This new high-speed core delivers\nthe performance and bandwidth that new designs require, now with higher data\ntransfer rates. The higher performance Interlaken Core is fully scalable,\nideally suited for multiple generations of future network switches, routers\nand storage equipment. The scalability is achieved through the combination of\nthe SERDES speed (3.125Gbps to 6.375Gbps) and a variable number of SERDES\nlanes (1 to 24).\n\n\nSLE is currently shipping the new 150Gb/s core, and customers report that\nthe IP delivers the highest data transfer rates available on the market today.\n"SLE continues to bring innovative, industry-first technology to market" said\nJeff West, Vice President of Design Services, SLE - a division of Tundra\nSemiconductor. "Tundra's customers have come to rely on the quality and\nreliability of SLE's custom design services and IP core development."\n\n\nDesigned and tested to be easily synthesizable into any ASIC technology,\nSLE's Interlaken IP Core was built to work with off-the-shelf SERDES from most\nleading technology vendors. Using the vendor specific proven SERDES allows SLE\ncustomers to quickly integrate the Interlaken IP Core into the customer's\ntechnology of choice.\n\n\n"Tundra is committed to delivering outstanding design services and\nquality IP to customers. SLE continues to demonstrate our commitment to\nworld-class design and development and Tier 1 customer response to this\nenhanced Interlaken core demonstrates strong market acceptance of this\nfirst-to-market IP offering," said Daniel Hoste, President and Chief Executive\nOfficer, Tundra Semiconductor.\n\n\nProduct Availability\n\n\nThe SLE licensable 150 Gigabit Interlaken IP is available through SLE's\nsales network. For sales related questions, contact sales at\[email protected] or call SLE...