Tundra Strengthens Leadership Position with Roadmap Detailing Future Host Bridges for PowerPC(R)

Customers Will Take Advantage of Exceptional Performance, Low Power, and 
System Cost Savings

OTTAWA, ON, June 16 /CNW Telbec/ - Tundra Semiconductor Corporation
(TSX: TUN), the leader in System Interconnect, today strengthened its position
as the industry's leading supplier of host bridges for PowerPC by announcing
the details of its roadmap and vision for next-generation host bridges
supporting PowerPC processor-based designs. By aligning their PowerPC-based
designs with this high performance roadmap customers can take advantage of
best system performance, best system cost, best system power, and best signal
integrity.

Setting the Standard For Over A Decade

Building on a decade of investment and expertise of supporting PowerPC
processor-based designs, Tundra continues to expand its portfolio of companion
devices that deliver industry-leading system performance, power and cost for
customers in the communications, pervasive computing, military, and industrial
automation markets. Tundra's earlier devices are well suited for 60x-bus based
processors and Freescale Semiconductor's line of PowerQUICC(TM) processors and
include: PowerSpan(TM), PowerSpan(TM) II, PowerPro(TM), and QSpan(TM) II. As a
result of the acquisition of Freescale's host bridge product line in 2003,
Tundra enhanced its offerings with the Tsi106(TM) and the Tsi107(TM). More
recently, the roll out of the Tundra Tsi108(TM) family of next-generation host
bridges including, the Tsi108 and new Tsi108A(TM) has underscored Tundra's
role as the industry's leading supplier of companion chips for Freescale
Semiconductor and IBM's PowerPC processors.

Compelling Roadmap for the Future

Host bridges (also known as system controllers) interconnect processors
with subsystems in embedded designs. Tundra's host bridge roadmap for PowerPC
reflects the investment and commitment to addressing the current and future
needs of PowerPC processor-based designs. Future host bridges will continue to
be aligned with Tundra's focus on delivering best system performance, best
system cost, and best system power to customers. With a choice of two distinct
solution paths, customers can either choose a highly integrated high
performance path or offerings with reduced feature sets focused on system cost
optimization. By providing software compatibility across the family of
bridges, designers can maintain their software investment while taking
advantage of the latest generation of devices.
The Tsi108 family will continue to grow with variants that increase
performance through higher speed CPU and memory interfaces, lower memory
latency, and multiprocessor support. In addition, as the system interconnect
landscape migrates from parallel standards towards high-speed serial fabrics,
there will be significant increases in next-generation interconnect
performance. Customers will benefit from Tundra's RapidIO leadership and
ongoing investment as high speed serial interconnects such as RapidIO(R) and
PCI Express(R) become part of host bridge interconnect offerings.
The high performance roadmap will continue to optimize system power
through integration of key features such as clock generation, support of power
efficient high performance memory such as DDR2, and advanced features such as
dynamic power management. Cost sensitive applications will be addressed
through various offerings that are focused on offering best system performance-
per-dollar through reduced functionality and board space. Tundra will continue
to focus on offering products with best signal integrity benefits to ease the
challenge of high-speed designs faced by customers. This is evident in the
Tsi108 and Tsi108A packaging, ball map, and input/output (I/O) features, which
were all, designed with signal integrity in mind and will also to be evident
in future devices.

Endorsed by the Industry Leaders

"The PowerPC space is undergoing two new transitions. First, the
performance and low power of PowerPC processors is being incorporated into
new, cost sensitive applications, like printers and gaming. Second, the system
interconnect migration from parallel standards to serial fabrics, such as
serial RapidIO and PCI Express, is enabling significant increases in system
performance," said Christopher Kissel, Industry Analyst at In-Stat. "Tundra's
portfolio of high performance PowerPC host bridges and their associated
roadmap addresses these new transitions and provides customers with compelling
reasons to continue to grow their investment in PowerPC-based applications."
"We are excited about the Tundra PowerPC companion chip roadmap as it
demonstrates Tundra's leadership in delivering best-in-class host bridges that
optimize overall system performance, power, and cost" said Bill Dunnigan, Vice
President at Freescale Semiconductor and General Manager of Freescale's
Computing Platforms Division. "Our complementary roadmaps offer customers
innovative architectures, compelling price and low power combinations, world
class technical support, and significant performance advantages for an
increasing range of applications."
"When combined with PowerPC processors, specifically the IBM 750FL and
750GL, Tundra's portfolio of next-generation PowerPC host bridges offers
system performance with a focus on optimizing both power and cost," said Mark
Ireland, Manager of IBM's Semiconductor Marketing. "Customers are enthusiastic
about the investments both companies have made in developing PowerPC processor
and companion chip roadmaps that are complementarily focused on providing
Power Architecture(TM) solutions for their demanding low power and cost
applications."
Tundra's roadmap for future host bridges was produced in collaboration
with Freescale and IBM as well as from in-depth discussions with its key
PowerPC customers. Tundra has been actively sharing the details of its host
bridge roadmap with customers since the beginning of this year, and the
overwhelming feedback is that it addresses designers' requirements for greater
performance in next-generation power and cost sensitive applications.

About Tundra

Tundra Semiconductor Corporation delivers standards-based System
Interconnect for use by the world's leading communications, networking,
storage system, and information technology vendors. Tundra System Interconnect
allows customers to link critical system components while compressing
development cycles and maximizing performance. Applications include wireless
infrastructure, storage networking, network access, military use, industrial
automation, and information technology. For more information, please visit
www.tundra.com .

TUNDRA is a registered trademark of Tundra Semiconductor Corporation
(Canada, U.S. and U.K.). TUNDRA, the Tundra logo, QSpan, PowerSpan, PowerPro,
Tsi106, Tsi107, Tsi108 and Tsi108A are trademarks of Tundra Semiconductor
Corporation. Other registered and unregistered trademarks are the property of
their respective owners. The PowerPC name, Power Architecture name, and the
PowerPC logotype are trademarks of International Business Machines
Corporation, used under license therefrom.

(C) Copyright 2005 Tundra Semiconductor Corporation. All rights reserved.
Information subject to change without notice.