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Tundra Semiconductor Announces Interoperability of Tundra's Scalable Serial RapidIO(R) Switch with Texas Instruments New High Performance DSP
Tundra Semiconductor Announces Interoperability of Tundra's Scalable Serial RapidIO(R) Switch with Texas Instruments New High Performance DSP.
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[{"type":"text","content":"\n\n\n\nSerial RapidIO Switch and DSP Combination, Now Enables High Performance\n\n\nBroadband Systems\n\n\nDALLAS, TX and OTTAWA, ON, March 7 /CNW Telbec/ - Tundra Semiconductor\nCorporation (TSX:TUN), the leader in System Interconnect, today announced the\ninteroperability of Tundra's Tsi578(TM) Serial RapidIO(R) Switch with Texas\nInstruments recently announced TMS320TCI6487 and TMS320TCI6488 wireless\ninfrastructure optimized DSPs.\n\n\nUsing the Tundra Tsi578 Serial RapidIO development platform, Tundra and\nTexas Instruments recently completed interoperability testing. The successful\ntests prove that Tundra's third generation Serial RapidIO switch, with\nmulti-cast capability, and Texas Instrument's 3-core, 3GHz DSPs can be\ndeployed to develop DSP clusters, aggregated with Serial RapidIO switching.\nThis combination is ideally suited for high data intensive applications such\nas WiMAX, 3G, LTE, TD-SCDMA and WiBRO. These types of applications require\nmultiple DSPs on a single channel card and the Tsi578 switch is uniquely\nsuited to interconnect the high bandwidth-capable DSPs. Delivering this\ncombined solution will enable base station manufacturers to achieve optimal\nperformance of their platform while spanning a wide range of air interfaces.\n\n\n"Some of our wireless infrastructure customers have begun designing this\nhigh performance combination of industry-leading products, thereby enabling\ntheir next-generation RapidIO-based systems to meet the OFDM processing and\nTurbo Decode requirements," said Daniel Hoste, President and Chief Executive\nOfficer at Tundra. "The Tundra/TI solution offers the power and\nconfigurability that designers of embedded solutions need to build reliable,\nhigh performance RapidIO-based systems for a wide range of scalable and high\nbandwidth applications".\n\n\n"The TCI6487 and TCI6488 DSPs deliver maximum performance with a\nsignificantly reduced bill of materials," said Travis Scheckel, TI's RapidIO\nDevelopment Manager and Chair of the RapidIO Technical Working Group.\n"Interoperability testing such as this effort gives base station manufacturers\na measure of confidence that their solution will meet the carriers' needs in a\ntimely fashion, while delivering higher performance, greater scalability and\nlow power."\n\n\nTexas Instruments announc...