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Tundra Semiconductor Announces First End-to-End RapidIO Baseband Development Platform
RapidIO Enables 10 Gbps Bandwidth across the Backplane and Chip-to-Chip DALLAS, TX, Feb. 25 /CNW ...
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[{"type":"text","content":"\n\n\n\nRapidIO Enables 10 Gbps Bandwidth across the Backplane and Chip-to-Chip\n\n\nDALLAS, TX, Feb. 25 /CNW Telbec/ - Texas Instruments Developers\nConference 2008 - Tundra Semiconductor Corporation (TSX:TUN), a leader in\nSystem Interconnect, today announced the availability of the market's first\nend-to-end RapidIO(R)-enabled MicroTCA(TM) platform for wireless baseband. The\nplatform, offers end-to-end 10 Gigabit RapidIO Interconnect for chip-to-chip\nand board-to-board links across the backplane.\n\n\nThe platform will allow wireless telecommunication system vendors to\nexpedite their go-to-market schedule with this "baseband-in-a-box" solution.\nProduction-ready components, available now, will speed wireless infrastructure\ndesign cycles and free up resources to focus on application firmware and\nsoftware development. Leveraging the industry's leading semiconductor\ncomponents, vendors can go to market in full volume production ahead of their\ncompetition.\n\n\n"The baseband platform is a unique solution designed to specifically\naddress wireless base station vendor requirements," said Kathy Brown, product\nmanager for communications infrastructure, digital signal processor systems\n(DSP), Texas Instruments (TI). "Base station manufacturers rely on TI's high\nperformance DSPs to accommodate bandwidth intense applications, and this new\nplatform allows our customers to focus on custom base station development with\na production-ready, interoperable hardware system in place."\n\n\n"This industry-leading combination of high performance products will\nchange the way our customers develop wireless baseband stations. This\n'baseband-in-a-box' solution is a revolutionary way for customers to take\nadvantage of the best the market has to offer, in an off-the-shelf solution\nleveraging the MicroTCA and RapidIO standards," said Daniel Hoste, President\nand Chief Executive Officer, Tundra Semiconductor. "This platform offers the\nprocessing power and configurability that designers of embedded solutions need\nto build reliable, high performance RapidIO-based systems for a wide range of\nscalable and high bandwidth applications".\n\n\nFour leading vendors supply the components of this industry-first RapidIO\nplatform:\n\n\n - Mercury Ensemble MSW-100 RapidIO MicroTCA Switch Module, incl...