Tundra Expands Industry leading Portfolio of Serial Rapidio(R) Switches

New Tundra Switches Deliver Reliable, High Performance Serial RapidIO to 
Next-Generation System Designs

OTTAWA, Ontario, Canada, May 16 /CNW Telbec/ - Tundra Semiconductor
Corporation (TSX:TUN), the leader in System Interconnect, today launched the
Tsi564A(TM) serial RapidIO switch. This product marks another significant
milestone in the ongoing development of the RapidIO ecosystem and further
extends Tundra's leadership in RapidIO System Interconnect. The Tsi564A builds
on the patent-pending technology of the Tundra Tsi568A(TM), launched in
February 2005, enabling reliable and high performance RapidIO interconnect in
a smaller footprint for cost effective systems.
Both the Tsi568A and the Tsi564A deliver the performance, power and
configurability that enable embedded designers to build reliable, high
performance communications systems for a broad spectrum of telecom, video,
imaging and networking applications. With a smaller footprint than the
Tsi568A, the Tsi564A offers low power, multiple port-widths and speed
configurations, making it ideally suited for applications where power, cost
and board space are primary concerns. This switch interconnects serial RapidIO
enabled processors and peripheral devices, supporting an aggregate bandwidth
of 40 gigabits per second.
RapidIO, the leading interconnect standard for embedded systems,
addresses the embedded industry's requirements for complex systems, high
reliability, and increased bandwidth, in intra-system interconnect. Tundra's
switch fabric portfolio, including the Tsi500(TM), Tsi568A and Tsi564A,
enables customers to upgrade their current systems and provides scalable
solutions across multiple product portfolios.
"The addition of the Tsi564A to Tundra's serial RapidIO switch family is
an important addition to the RapidIO ecosystem for our high performance
TMS320C6455 digital signal processor (DSP)," says Thomas Brooks, DSP Platform
Marketing Manager at Texas Instruments. "Designers can leverage the
flexibility of a C6455 DSP cluster and Tsi564A switch solution to achieve
maximum architectural scalability for a wide range of media processing,
telecom and high resolution imaging applications."
"The Tundra Tsi564A serial RapidIO switch provides the performance
required by increasing I/O bandwidth found on next generation processors,"
says Paul Mesibov, Director of Engineering at Pentek Inc. "The Tsi564A switch
and TI's C6455 DSP with integrated serial RapidIO provide a range of solutions
that optimize performance, power efficiency, and the flexibility required for
our next-generation platforms."
"Given the numerous product announcements so far this year, the RapidIO
Interconnect standard is set to enjoy significant acceptance in 2005 based on
its flexible design and support from leading players in the embedded
marketplace," said Jag Bolaria, Senior Analyst at The Linley Group. "The
addition of a second Tundra serial RapidIO switch adds greater depth to the
RapidIO ecosystem."
"By introducing a lower cost, smaller footprint switch backed by our
industry leading support tools, we are demonstrating our continued commitment
to enabling our customers' success in advanced System Interconnect," says Rick
O'Connor, Chief Technology Officer and Vice President of Product Management at
Tundra. "Tundra continues to develop System Interconnect products that build
on our innovative switch fabric technology, providing increased performance
and configurability not feasible with proprietary bus-based architectures."

Tsi564A AVAILABILITY & PRICING

The Tundra Tsi564A will be available through Tundra's worldwide sales
network in June 2005. Documentation, including ordering information, user
manuals, and software drivers, is available at www.tundra.com . Volume pricing
for the Tsi564A is under $59 USD.

Tsi564A PRODUCT DESCRIPTION

Using 0.13-micron technology and integrated SerDes functionality, the
Tsi564A Serial RapidIO Switch is a semiconductor chip that will be used in
many embedded communications applications. It provides chip-to-chip
interconnect between processing and input/output devices and can replace
existing proprietary backplane fabrics for board-to-board interconnect.

Highly configurable for tailored solutions:
- Up to four 4x links
- Up to eight 1x links
- Supports 1.25, 2.5 and 3.125 GBaud rates
- Configurable on port width and speed
- Port power down
- Programmable SerDes
- Hot Swappable

High-performance:
- More processing power-per-watt through distributed processing
- Low latency and cut through (port-to-port without interruption)
- Full duplex, line rate termination, non-blocking fabric
- Prevention of head-of-line blocking
- 10 Gbps links
- CRC handing for hardware-based error recovery
- Error status and reporting for high availability

Advanced packaging:
- Pb-free packaging (lead-free) available
- Integrated XAUI SerDes
- Small 21 x 21 mm package, 399 ball

ABOUT TUNDRA

Tundra Semiconductor Corporation delivers standards-based System
Interconnect for use by the world's leading communications, networking,
storage system, and information technology vendors. Tundra System Interconnect
allows customers to link critical system components while compressing
development cycles and maximizing performance. Applications include wireless
infrastructure, storage networking, network access, military applications,
industrial automation, and information technology. For more information,
please visit www.tundra.com .

TUNDRA is a registered trademark of Tundra Semiconductor Corporation
(Canada, U.S. and U.K.). TUNDRA, the Tundra logo, Tsi500, Tsi568A and Tsi564A
are trademarks of Tundra Semiconductor Corporation. Other registered and
unregistered trademarks are the property of their respective owners.

(C) Copyright 2005 Tundra Semiconductor Corporation. All rights reserved.
Information subject to change without notice.