Press release
Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry
3DIC Compiler Co-Design and Analysis Solution Combined with Synopsys IP Accelerates Heterogeneous Integration for Intel Foundry's EMIB Technology Highlights
About this update from Synopsys, Inc.
[{"type":"text","content":"3DIC Compiler Co-Design and Analysis Solution Combined with Synopsys IP Accelerates Heterogeneous Integration for Intel Foundry's EMIB Technology\nHighlights\nSynopsys AI-driven multi-die reference flow now extended for Intel Foundry's EMIB advanced packaging technology accelerates quality-of-results for heterogeneous integrationSynopsys 3DIC Compiler, a unified exploration-to-signoff platform, supports multi-die co-design of Intel Foundry's EMIB technologySynopsys IP for multi-die design supports efficient die-to-die connectivity and high memory bandwidth requirementsSUNNYVALE, Calif., June 24, 2024 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced the availability of its production-ready multi-die reference flow, powered by Synopsys.ai™ EDA suite, and Synopsys IP for Intel Foundry's embedded multi-die interconnect bridge (EMIB) advanced packaging technology. The optimized reference flow provides a unified co-design and analysis solution, enabled by Synopsys 3DIC Compiler to accelerate exploration and development of multi-die designs at all stages from silicon to systems. In addition, Synopsys 3DSO.ai is natively integrated with Synopsys 3DIC Compiler, enabling optimization for signal, power and thermal integrity with unparalleled productivity gains and maximum system performance.\n\n \n \n \n \n \n \n\n \n\"As bandwidth demands soar to new heights, companies are turning to multi-die designs at an accelerated pace to achieve greater levels of processing power and performance for their AI and high-performance computing applications,\" said Sanjay Bali, vice president of strategy and product management for the Synopsys EDA Group. \"Our long-standing and deep collaboration with Intel Foundry, resulting in a production-ready AI-driven multi-die reference flow for EMIB technology, provides our mutual customers with a comprehensive solution that helps them develop their billion- to trillion-transistor multi-die systems.\" \n\"Addressing the design and packaging complexities of multi-die architectures requires a holistic approach to solving the thermal, signal integrity, and interconnect challenges,\" said Suk Lee, VP & GM of Ecosystem Technology Office, at Intel Foundry. \"Intel Foundry's manufacturing and advanced packaging technologies, combined with Synopsys' certified multi-die reference flow and trusted IP, provides ...