Press release
AI-designed Chips Reach Scale with First 100 Commercial Tape-outs Using Synopsys Technology
Award-winning Synopsys DSO.ai Solution Transforms Customer Capability with Significant Productivity and Performance Gains, and Cloud Scalability Key
About this update from Synopsys, Inc.
[{"type":"text","content":"Award-winning Synopsys DSO.ai Solution Transforms Customer Capability with Significant Productivity and Performance Gains, and Cloud Scalability \nKey Highlights:\nChip design ecosystem working with Synopsys achieves first 100 commercial tape-outs across a range of applications and advanced nodesSTMicroelectronics achieves the first-ever commercial design tape-out using AI on the cloud, realizing a 3x productivity uplift for power, performance and area (PPA) using Synopsys DSO.ai on Microsoft AzureSK hynix reduced die size by up to 5% on the most advanced process technologiesSynopsys DSO.ai uses reinforcement learning to enhance PPA in very large solution spaces, saving months of manual effortMOUNTAIN VIEW, Calif., Feb. 7, 2023 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) reaches scale for AI-driven chip designs as major semiconductor customers register the first 100 commercial tape-outs with the company's award-winning Synopsys DSO.ai™ autonomous design system. Recent customers, including STMicroelectronics and SK hynix, have all seen significant uplifts in productivity and PPA, and are now charting a new design course using reinforcement learning-enabled design tools on cloud and on-premise.\n\n \n \n \n \n \n \n\n \nBy using Synopsys DSO.ai (Design Space Optimization AI) the companies are setting a blistering pace for the development of advanced-node chips through the key design phases. Results from customers since the launch of Synopsys DSO.ai speak for themselves: more than 3x productivity increases, up to 25% lower total power and significant reduction in die size, with reduced use of overall resources.\nSTMicroelectronics (ST), a global semiconductor leader serving customers across the spectrum of electronics applications, is using cloud-based versions of DSO.ai to generate extra momentum on the most intensive design phases. STMicroelectronics taped-out using Synopsys DSO.ai coupled with Synopsys Fusion Compiler™ and Synopsys IC Compiler™ II physical implementation tools.\n\"Using the Synopsys DSO.ai design system on Microsoft Azure, we increased PPA exploration productivity by more than 3x, allowing us fast implementation of a new Arm core, while exceeding power, performance and area goals,\" said Philippe d'Audigier, system-on-chip hardware design director at STMicroelectronics. \"We look forward to accelerating our co...