Socionext Inc.

Socionext Unveils "Flexlets™", a Configurable Chiplet Ecosystem to Accelerate Multi-die Silicon Innovation

Socionext Expands 3DIC Support with Advanced 3D Die Stacking and 5.5D in Packaging Portfolio

aiMotive Signs License Agreement with Socionext for aiWare NPU IP to Power Next-Gen ADAS SoC

New White Paper Outlines Proven Methodology for High-Bandwidth Switch Fabric SoC Success