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Smartkem To Unveil First Demo of a MicroLED-in-a-Package (MiP) Backlight at Touch Taiwan 2025
Smartkem Chairman and CEO, Ian Jenks, to Deliver Keynote Address on Transformative MicroLED technology MANCHESTER, England, March 17, 2025 /PRNewswire/ --
About this update from Smartkem, Inc.
[{"type":"text","content":"Smartkem Chairman and CEO, Ian Jenks, to Deliver Keynote Address on Transformative MicroLED technology\nMANCHESTER, England, March 17, 2025 /PRNewswire/ -- Smartkem (NASDAQ: SMTK), which is seeking to change the world of electronics with a new class of transistor technology, will unveil the first MicroLED-in-a-Package (MiP) backlight using its unique and proprietary technology at this year's Touch Taiwan conference in Taipei City, Taiwan which runs from April 16-18th 2025. Smartkem Chairman and CEO, Ian Jenks, will deliver a keynote presentation exploring Smartkem's disruptive MiP backlight technology and its potential impact on the global display market.\n\n \n \n \n \n \n \n\n \nKeynote Presentation DetailsDate: April, 16, 2025Time: 16:00-16:25 Location: Room 401, Nangang Exhibition Center Hall 1, Taipei City, Taiwan\nSmartkem's 'chip-first' MicroLED architecture introduces a breakthrough approach to MicroLED display manufacturing with a low temperature process that simplifies production, improves yields and delivers an enhanced display performance. This new MicroLED-in-a-Package (MiP) backlight simplifies assembly and yield management for display manufacturers and is designed for seamless integration of MicroLEDs to enhance today's Liquid Crystal Display (LCD) market, which represents approximately 65% of the global display industry1.\n\"Smartkem's mission is to enable the next generation of displays using our transistor technology,\" said Ian Jenks, Chairman and CEO of Smartkem. \"This demonstration shows how our 'chip-first' approach creates a new category of MicroLED-in-a-Package (MiP) backlight that can use MicroLEDs to transform LCD display technology. This innovation allows LCDs and large-scale signage to achieve low power consumption, high contrast ratios, and exceptional readability—even in bright environments. Importantly, this demonstration shows that Smartkem's technology can be used to enable the next generation of MicroLED displays as well as to improve existing display technologies including LCDs.\nSmartkem's MiP4At the core of this advancement is Smartkem's proprietary Redistribution Layer (RDL) material, which interconnects four chip-first MicroLEDs in a series to form a single high-voltage chip—the MiP4. This MiP4 package is designed to replace existing MiniLED packages in LCD backlights and signage applicati...