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SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will open a customer exhibition booth at Venetian Expo and showcase its next generation AI memory solution at CES 2026, in Las Vegas from January 6 to 9 (local time).
About this update from Sk Hynix Inc.
[{"type":"list","items":[{"val":[{"type":"text","content":"SK hynix to operate customer exhibition booth to enhance customer connection ","length":76,"tagName":"p"}]},{"val":[{"type":"text","content":"Unveils 16-layer HBM4 with 48GB for the first time and showcases conventional and AI focused products such as SOCAMM2 and LPDDR6 ","length":128,"tagName":"p"}]},{"val":[{"type":"text","content":"With 'AI System Demo Zone', visualizes custom HBM structure to present future technology","length":96,"tagName":"p"}]},{"val":[{"type":"text","content":"Company to create new value based on differentiated memory solution and close collaboration with customers","length":106,"tagName":"p"}]}],"tagName":"ul","bulletedList":true,"length":406,"olType":false},{"type":"text","content":"SEOUL, South Korea, Jan. 5, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will open a customer exhibition booth at Venetian Expo and showcase its next generation AI memory solution at CES 2026, in Las Vegas from January 6 to 9 (local time).","length":299,"tagName":"p"},{"type":"text","content":"The company said that, "Under the theme 'Innovative AI, Sustainable tomorrow', we plan to showcase a wide range of next generation memory solutions optimized for AI and will work closely with customers to create new value in the AI era."","length":255,"tagName":"p"},{"type":"text","content":"SK hynix has previously operated both a SK Group joint exhibition and a customer exhibition booth at CES. This year, the company will focus on the customer exhibition booth to expand touchpoint with key customers to discuss potential collaboration.","length":248,"tagName":"p"},{"type":"text","content":"The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with 36GB, which demonstrated industry's fastest speed of 11.7Gbps, and is under development aligned with customers' schedules.","length":329,"tagName":"p"},{"type":"text","content":"12-layer HBM3E product with 36GB which will drive the market this year will also be presented. In particular, the company will jointly exhibit GPU modules that have adopted HBM3E for AI servers with customer and demonstrate its role within AI systems.","le...