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SK hynix and Sandisk Begin Global Standardization of Next-Generation Memory 'HBF'
SK hynix Inc. (or "the company", www.skhynix.com) and Sandisk Corporation held 'HBF Spec. Standardization Consortium Kick-Off' event at Sandisk Headquarters in Milpitas, California on the 25th(local time) announcing global standardization strategy of next-generation memory solution HBF(High Bandwidth Flash) aimed at the AI inference era.
About this update from Sk Hynix Inc.
[{"type":"text","content":"- SK hynix and Sandisk form a joint workstream under OCP to start standardization - New memory layer between HBM and SSD to secure scalability and power efficiency in AI inference infrastructure","length":200,"tagName":"p"},{"type":"text","content":"SEOUL, South Korea, Feb. 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) and Sandisk Corporation held 'HBF Spec. Standardization Consortium Kick-Off' event at Sandisk Headquarters in Milpitas, California on the 25th(local time) announcing global standardization strategy of next-generation memory solution HBF(High Bandwidth Flash) aimed at the AI inference era.","length":412,"tagName":"p"},{"type":"text","content":"SK hynix said, "By making HBF an industry standard, together with Sandisk, we will lay the foundation for the entire AI ecosystem to grow together. A dedicated workstream under OCP[1] will be launched with Sandisk to begin standardization work."","length":255,"tagName":"p"},{"type":"table","headerItems":[],"items":[{"val":[{"colspan":"1","rowspan":"1","style":"PADDING-RIGHT:0.17em;PADDING-LEFT:0.17em;","val":[{"type":"text","content":"[1] Open Compute Project (OCP): A world's largest open data center technology initiative","length":92,"tagName":"p","attribs":{}}]}]}],"length":92},{"type":"text","content":"Recently, the AI industry is shifting from training which focuses on creating Large Language Models (LLMs) to inference, which accelerates actual AI services to users.","length":167,"tagName":"p"},{"type":"text","content":"Fast and efficient memory is essential as the number of users using AI services increases rapidly. However, the existing memory structure cannot meet the high capacity data processing and power efficiency at the same time in the inference stage and HBF technology is designed to address these limitations.","length":305,"tagName":"p"},{"type":"text","content":"HBF technology is a new memory layer between ultra-fast memory, HBM and high-capacity storage device, SSD. HBF technology can fill the gap between HBM's high performance and SSD's high capacity and ensure both capacity expansion and power efficiency required for AI inferencing. While HBM handles the high level bandwidth, HBF technology serves as a supporting layer in the architecture.","length":395,"tagName":"p"},{"type":"te...