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Sivers Semiconductors, O-Net and Enablence Technologies Announce Collaboration on Co-Packaged Optics
Trio to Develop 8-Channel External Light Source (ELS) for AI Datacenters and HPC SystemsFremont, California--(Newsfile Corp. - March 17, 2026) - Enablence Technologies (TSXV: ENA) a leading supplier of planar lightwave circuit (PLC) optical chips for datacom, telecom, artificial intelligence (AI), and advanced vision applications, today announced a strategic partnership with Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, and O-Net Technologies, a...
About this update from Sivers Semiconductors Ab
[{"type":"text","content":"Trio to Develop 8-Channel External Light Source (ELS) for AI Datacenters and HPC Systems","length":88,"tagName":"p","attribs":{"class":"nfSubHeading"},"className":""},{"type":"text","content":"Fremont, California--(Newsfile Corp. - March 17, 2026) - Enablence Technologies (TSXV: ENA) a leading supplier of planar lightwave circuit (PLC) optical chips for datacom, telecom, artificial intelligence (AI), and advanced vision applications, today announced a strategic partnership with Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, and O-Net Technologies, a global leader in the design, development and manufacturing of advanced optoelectronic products, to develop an 8-channel external light source (ELS) module for AI datacenters and HPC systems. All three companies will be showcasing their optics solutions and discussing the collaboration at the upcoming OFC Show in Los Angeles from March 17 to March 20. You can visit Enablence at booth 4812, Sivers at booth 1250, and O-Net at booth 2039.","length":853,"tagName":"p"},{"type":"text","content":"Under the agreement, O-Net Technologies will serve as the OEM partner, integrating Sivers Semiconductors' laser arrays and Enablence's NxN Star Coupler to deliver a scalable ELS module for next-generation scale-out and scale-up optical systems.","length":252,"tagName":"p"},{"type":"text","content":""External light sources are critical to scalable co-packaged optics," said Alex McCann, Managing Director for Sivers' Photonics business. "Our DFB laser arrays deliver the performance, reliability, and wavelength stability required for evolving CPO architectures, which will accelerate the deployment of next-generation AI infrastructure, including high performance computing systems (HCPs) and next-generation data centers."","length":449,"tagName":"p"},{"type":"text","content":""A recent McKinsey report forecasts the AI infrastructure market will surpass $7 trillion by 2030 and many even believe this to be a conservative number," noted Todd Haugen, CEO, Enablence Technologies. "Meeting the needs of this fast-growing sector means accelerating commercialization of high-performance CPO architectures as one of a handful of optics solutions that can meet AI data center compute requirements. "Collaboration is a...