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Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices
Lura Health uses new BG27 SoC to create a sensor smaller than a tooth to collect salivary data AUSTIN, Texas, March 14, 2023 /PRNewswire/ -- Silicon Labs
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[{"type":"text","content":"Lura Health uses new BG27 SoC to create a sensor smaller than a tooth to collect salivary data\nAUSTIN, Texas, March 14, 2023 /PRNewswire/ -- Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).\n\n \n \n \n \n \n \n\n \nDesigned for the smallest IoT devices, the xG27 and BB50 families range in size from 2 mm-squared, about the width of a #2 pencil lead, to 5 mm-squared, less than the width of a standard #2 pencil. These offer IoT device designers energy efficiency, high performance, trusted security, and in the case of the xG27 family, wireless connectivity. This makes the xG27 SoC family and BB50 MCU ideal for tiny, battery-optimized devices like connected medical devices, wearables, asset monitoring tags, smart sensors, simple consumer electronics like toothbrushes and toys, and more.\n\"Silicon Labs is the pure-play IoT leader, and our breadth, depth, and focus enable us to support the broadest range of wireless connectivity protocols of any semiconductor company,\" said Silicon Labs CEO Matt Johnson. \"The xG27 SoCs and BB50 MCUs are helping developers build exciting new devices while also simplifying their development processes, all while maintaining the low-power and small form-factor requirements for extremely small devices.\"\nxG27 SoC Connects One of World's Smallest Wearable Devices\nThe new xG27 family of SoCs comprises the BG27, for Bluetooth connectivity, and the MG27, supporting Zigbee and other proprietary protocols. Built around the ARM Cortex M33 processor, the BG27 and MG27 share several common features designed to make them the ideal SoC for small form-factor devices, including:\nWafer-level Chip Scale Packaging as small as 2.3 mm x 2.6 mm, ideal for compact and unobtrusive devices like medical patches, continuous glucose monitors, wearable electrocardiograms, and asset tags in various settings like retail and agriculture.Integrated DCDC Boost that can allow the devices to operate on batteries as low as 0.8 V, thereby reducing their devices' size, form factor, and cost.Integrated Coulomb Counter that enables battery level monitoring to avoid battery depletion d...