SuperX and Chengtian Weiye Establish Joint Venture SuperX Cooltech to Jointly Launch AI Liquid Cooling Solutions

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[{"type":"text","content":"SINGAPORE, Oct. 24, 2025 /PRNewswire/ -- SuperX AI Technology Limited (NASDAQ: SUPX) ("the Company" or "SuperX") today announced that it has entered into a definitive agreement with the Hong Kong wholly-owned subsidiary of Shenzhen Chengtian Weiye Technology Co., Ltd. (Shenzhen Stock Exchange: 300689, "Chengtian Weiye") and its affiliates to jointly establish a joint venture company, SuperX Cooltech Pte. Ltd. ("SuperX Cooltech"), in Singapore. SuperX will become the single largest shareholder of the joint venture.","length":559,"tagName":"p"},{"type":"image","alt":"SuperX Logo (PRNewsfoto/SuperX AI Technology Limited)","displaySize":"","headline":null,"caption":"SuperX Logo (PRNewsfoto/SuperX AI Technology Limited)","className":"","disableSlideshowImg":false,"size":{"original":{"width":400,"height":400,"url":"https://media.zenfs.com/en/prnewswire.com/450f302f43264f50ea12e77c3b409af2"},"resized":{"url":"https://s.yimg.com/ny/api/res/1.2/vrPD7GnCPZ7gntXlDATPow--/YXBwaWQ9aGlnaGxhbmRlcjt3PTcwNTtoPTcwNTtjZj13ZWJw/https://media.zenfs.com/en/prnewswire.com/450f302f43264f50ea12e77c3b409af2","width":400,"height":400}},"href":"https://mma.prnewswire.com/media/2738991/SuperX_Blue_Logo.html","hrefExternal":true,"rel":"nofollow"},{"type":"text","content":"The joint venture will integrate the advantages of both parties in AI system integration and thermal management core components, operating under the cooperative brand "SuperX Cooltech" to provide liquid cooling products and infrastructure solutions to the global market (excluding mainland China, Hong Kong SAR, and Macau SAR).","length":337,"tagName":"p"},{"type":"text","content":"Liquid Cooling Solutions: An Inevitable Industry Choice Driven by AI Iteration","length":78,"tagName":"p"},{"type":"text","content":"As new generation GPU architectures like NVIDIA Blackwell push single-rack power consumption above 100kW, traditional air cooling methods are struggling to meet the high heat flux management demands of AI training and inference clusters. Power consumption and heat dissipation have become key bottlenecks restricting the deployment density, operational efficiency, and total cost of ownership (TCO) of AI data centers.","length":418,"tagName":"p"},{"type":"text","content":"In this context, efficient rack-level liquid cooling technologies, ...

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