Business

Semtech Charts Path to 3.2T Connectivity for Next-Gen AI Data Centers

Enabling 1.6T networks with 200G per channel Physical Medium Dependent IC (PMD) portfolio while advancing 400G per channel technology for 3.2T modules SAN

articleSemtech CorporationMarch 31, 20254/company/semtech-corporation/news/semtech-charts-path-32t-connectivity-next-gen-ai-data-centers-2025-03-31
Semtech Charts Path to 3.2T Connectivity for Next-Gen AI Data Centers

About this update from Semtech Corporation

[{"type":"text","content":"\nEnabling 1.6T networks with 200G per channel Physical Medium Dependent IC (PMD) portfolio while advancing 400G per channel technology for 3.2T modules\n\n SAN FRANCISCO & CAMARILLO, Calif.--(BUSINESS WIRE)--\nSemtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the expansion of its broad optical communications portfolio, featuring solutions across multiple generations of data center connectivity. These technology innovations help tackle the escalating requirements for higher speed, processing power and data throughput driven by Machine Learning (ML), Large Language Model (LLM) training, and Artificial Intelligence (AI) clusters.\nThis press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250331601619/en/Semtech Charts Path to 3.2T Connectivity for Next-Gen AI Data Centers\nAddressing the industry shift toward higher bandwidth density, Semtech's 200G per channel FiberEdge™ PMDs deliver exceptional performance, enabling future 800G and 1.6T modules while meeting critical power efficiency and space constraints. The company has also accelerated investments in pioneering 400G per channel technology to enable next-generation 3.2T modules, reinforcing Semtech's position as a technology leader driving high-performance connectivity across the rapidly evolving data infrastructure landscape.\n\n“The path to 3.2T connectivity requires overcoming significant technical barriers in both speed and power efficiency,” said Amit Thakar, vice president of signal integrity product marketing at Semtech. “Our 200G and 400G per channel innovations represent critical building blocks that enable the next generation of data center fabric. As AI models continue to grow exponentially in size and complexity, these architectural advances will help hyperscalers build the infrastructure foundation needed for tomorrow’s AI workloads while managing their data center power envelope.”\n\nGrowing Portfolio for Next-Generation AI Infrastructure\n\nSemtech’s 200G per channel PMD solutions are now available to enable the next wave of 1.6T optical module deployments essential for scaling AI training clusters, and include:\n\n\n112GBd PAM4 TIAs (Transimpedance Amplifiers):\n\n\nGN1832: linear TIA, 50...

More updates from Semtech Corporation