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SEMIFIVE Secures AI Semiconductor Design Projects in Japan, Accelerating Global Expansion with New Local Subsidiary
SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design preparing for its KOSDAQ listing, announced today that it has secured multiple AI semiconductor design projects in Japan and recently established its subsidiary in Tokyo, Japan. This move accelerates its global expansion to meet the rapidly increasing demand for Application-Specific Integrated Circuits (ASICs).
About this update from Samsung Electronics Co., Ltd.
[{"type":"text","content":"- Demonstrates end-to-end expertise in high-performance custom chip design for AI and HPC- Establishes a subsidiary in Japan to strengthen global reach","length":152,"tagName":"p"},{"type":"text","content":"SEOUL, South Korea, Dec. 11, 2025 /PRNewswire/ -- SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design preparing for its KOSDAQ listing, announced today that it has secured multiple AI semiconductor design projects in Japan and recently established its subsidiary in Tokyo, Japan. This move accelerates its global expansion to meet the rapidly increasing demand for Application-Specific Integrated Circuits (ASICs).","length":429,"tagName":"p"},{"type":"image","alt":"(PRNewsfoto/SEMIFIVE)","displaySize":"","headline":null,"caption":"(PRNewsfoto/SEMIFIVE)","className":"","disableSlideshowImg":false,"size":{"original":{"width":400,"height":400,"url":"https://media.zenfs.com/en/prnewswire.com/f667df0277465f282ef8d029c5848947"},"resized":{"url":"https://s.yimg.com/ny/api/res/1.2/yjBIyzQTyieRkATRxfrSMg--/YXBwaWQ9aGlnaGxhbmRlcjt3PTcwNTtoPTcwNTtjZj13ZWJw/https://media.zenfs.com/en/prnewswire.com/f667df0277465f282ef8d029c5848947","width":400,"height":400}},"href":"https://mma.prnewswire.com/media/2309398/SEMIFIVE_logo_Logo.html","hrefExternal":true,"rel":"nofollow"},{"type":"text","content":"These project wins were achieved based on customers' trust in SEMIFIVE's accumulated expertise in cutting-edge process nodes, extensive experience in turnkey design for large-die chips, and high-performance ASIC design capabilities based on core IP.","length":257,"tagName":"p"},{"type":"text","content":"In these newly secured projects, SEMIFIVE is developing high-performance semiconductors for AI and data center applications. Some of these projects will incorporate next-generation technologies such as 3D IC-based advanced packaging, which is expected to improve data-processing efficiency, reduce energy consumption, and increase integration density.","length":351,"tagName":"p"},{"type":"text","content":"Additionally, SEMIFIVE recently established a subsidiary in Tokyo, strengthening its ability to engage with local customers and manage projects more efficiently. This new subsidiary represents SEMIFIVE's sixth global location, following its established presence in the United States, China, Vietnam, India, and the Czech Republi...