Business
New Milestone Achieved! Fibocom's Fx550 5G Module Based on Samsung Exynos Modem Enters Global Mass Production
On March 31, Fibocom announced that its Fx550 5G module (including FM550 M.2 form factor and FG550 LGA form factor), developed based on the Samsung Exynos Modem chipset, has officially entered large-scale mass production. The commercial launch of this product not only marks a significant milestone in the strategic collaboration between Fibocom and Samsung, but also provides high-performance and highly reliable connectivity solutions for global 5G FWA (Fixed Wireless Access) and broadband IoT app
About this update from Samsung Electronics Co., Ltd.
[{"type":"text","content":"SHENZHEN, China, March 31, 2026 /PRNewswire/ -- On March 31, Fibocom announced that its Fx550 5G module (including FM550 M.2 form factor and FG550 LGA form factor), developed based on the Samsung Exynos Modem chipset, has officially entered large-scale mass production. The commercial launch of this product not only marks a significant milestone in the strategic collaboration between Fibocom and Samsung, but also provides high-performance and highly reliable connectivity solutions for global 5G FWA (Fixed Wireless Access) and broadband IoT applications, such as wireless fixed terminals, MiFi devices, and industrial gateways.","length":631,"tagName":"p"},{"type":"image","alt":"Fibocom’s FX550 5G Module Based on Samsung Exynos Modem Enters Global Mass Production","displaySize":"","headline":null,"caption":"Fibocom’s FX550 5G Module Based on Samsung Exynos Modem Enters Global Mass Production","className":"","disableSlideshowImg":false,"size":{"original":{"width":400,"height":225,"url":"https://media.zenfs.com/en/prnewswire.com/aa86ededfbe424e00b7f43b805fb44ca"},"resized":{"url":"https://s.yimg.com/ny/api/res/1.2/B2fuJdreJr9vcdIETQvOiA--/YXBwaWQ9aGlnaGxhbmRlcjt3PTcwNTtoPTM5Nw--/https://media.zenfs.com/en/prnewswire.com/aa86ededfbe424e00b7f43b805fb44ca","width":400,"height":225}},"href":"https://mma.prnewswire.com/media/2946682/1.html","hrefExternal":true,"rel":"nofollow"},{"type":"text","content":"Strong Partnership: Elevating 5G Connectivity to New Era","length":56,"tagName":"p"},{"type":"text","content":"This mass production milestone represents a key achievement in the deep strategic partnership between Fibocom and Samsung. Samsung's 5G chipset solutions have been widely validated through large-scale global deployments, known for their high stability, outstanding RF performance, and broad global compatibility. By integrating their technological strengths, both parties aim to leverage their expertise in chipset architecture and industry applications to accelerate the adoption and expansion of 5G across global vertical industries.","length":539,"tagName":"p"},{"type":"text","content":""At Samsung, we are pleased to deepen our strategic collaboration with Fibocom as we advance next generation 5G connectivity for global markets. The successful mass production of Fibocom's Fx550 module highlights our shared commit...