Press release
Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready Memory Subsystem
Highlights: - Provides HBM3-ready memory subsystem solution consisting of fully-integrated PHY and digital controller - Supports data rates up to 8.4 Gigabits
About this update from Rambus, Inc.
[{"type":"text","content":"Highlights:\n - Provides HBM3-ready memory subsystem solution consisting of fully-integrated PHY and digital controller\n - Supports data rates up to 8.4 Gigabits per second (Gbps), enabling terabyte-scale bandwidth accelerators for artificial intelligence/machine learning (AI/ML) and high-performance computing (HPC) applications\n - Leverages market-leading HBM2/2E experience and installed-base to speed implementation of customer designs using next-generation HBM3 memory\n\n\nSAN JOSE, Calif., Aug. 16, 2021 /PRNewswire/ -- Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the Rambus HBM3-ready memory interface subsystem consisting of a fully-integrated PHY and digital controller. Supporting breakthrough data rates of up to 8.4 Gbps, the solution can deliver over a terabyte per second of bandwidth, more than double that of high-end HBM2E memory subsystems. With a market-leading position in HBM2/2E memory interface deployments, Rambus is ideally suited to enable customers' implementations of accelerators using next-generation HBM3 memory. \n\n \n \n \n \n \n \n\n \n\"The memory bandwidth requirements of AI/ML training are insatiable with leading-edge training models now surpassing billions of parameters,\" said Soo Kyoum Kim, associate vice president, Memory Semiconductors at IDC. \"The Rambus HBM3-ready memory subsystem raises the bar for performance enabling state-of-the-art AI/ML and HPC applications.\" \nRambus achieves HBM3 operation of up to 8.4 Gbps leveraging over 30 years of high-speed signaling expertise, and a strong history of 2.5D memory system architecture design and enablement. In addition to the fully-integrated HBM3-ready memory subsystem, Rambus provides its customers with interposer and package reference designs to speed their products to market.\n\"With the performance achieved by our HBM3-ready memory subsystem, designers can deliver the bandwidth needed by the most demanding designs,\" said Matt Jones, general manager of Interface IP at Rambus. \"Our fully-integrated PHY and digital controller solution builds on our broad installed base of HBM2 customer deployments and is backed by a full suite of support services to ensure first-time right implementations for mission-critical AI/ML designs.\" \nBenefits of the Rambus HBM3-ready Memory Interface ...