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QuickLogic Corporation to Exhibit and Present at Chiplet Summit 2026
QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) IP and ruggedized FPGAs and chiplet solutions, today announced it will exhibit and deliver a technical presentation at Chiplet Summit 2026, the industry's premier conference focused on chiplet architectures, advanced packaging, and heterogeneous integration.
About this update from Quicklogic Corporation
[{"type":"text","content":"SAN JOSE, Calif., Feb. 11, 2026 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) IP and ruggedized FPGAs and chiplet solutions, today announced it will exhibit and deliver a technical presentation at Chiplet Summit 2026, the industry's premier conference focused on chiplet architectures, advanced packaging, and heterogeneous integration.","length":386,"tagName":"p"},{"type":"image","alt":"QuickLogic logo (PRNewsfoto/QuickLogic Corporation)","displaySize":"","headline":null,"caption":"QuickLogic logo (PRNewsfoto/QuickLogic Corporation)","className":"","disableSlideshowImg":false,"size":{"original":{"width":400,"height":77,"url":"https://media.zenfs.com/en/prnewswire.com/b58d5dea79e6518aa686b00496935a41"},"resized":{"url":"https://s.yimg.com/ny/api/res/1.2/aMQtILnEqvgZpy5F3VIpMw--/YXBwaWQ9aGlnaGxhbmRlcjt3PTcwNTtoPTEzNjtjZj13ZWJw/https://media.zenfs.com/en/prnewswire.com/b58d5dea79e6518aa686b00496935a41","width":400,"height":77}},"href":"https://mma.prnewswire.com/media/643697/QuickLogic_Logo.html","hrefExternal":true,"rel":"nofollow"},{"type":"text","content":"Chiplet Summit 2026 will take place February 17–19 in Santa Clara, California. QuickLogic will exhibit at Booth #416, where attendees can learn how its eFPGA IP and eFPGA-based chiplets enable flexible, scalable architectures for advanced heterogeneous integration.","length":265,"tagName":"p"},{"type":"text","content":"In addition, QuickLogic will present a technical session titled:","length":69,"tagName":"p"},{"type":"text","content":""Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel® 18A"","length":91,"tagName":"p"},{"type":"text","content":"The presentation will be delivered by Trey Peterson, Applications Engineer at QuickLogic, during Session E-202 on Thursday, February 19, from 3:00 p.m. to 4:20 p.m. The session will explore how eFPGA chiplets can be used to add post-silicon adaptability and extend platform flexibility in advanced process nodes.","length":312,"tagName":"p"},{"type":"text","content":"Chiplet Summit 2026 Exhibit Hours","length":33,"tagName":"p"},{"type":"list","items":[{"val":[{"type":"text","content":"Wednesday, February 18: 12:30 p.m. – 8:00 p.m.","length":46,"tagName":"p"}]},{"val":[{"type":"text","content":"Thursday, February 19: 12:00 p.m. – 3:00 p.m.","length":45...