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Hyundai Mobis and Qualcomm Sign Comprehensive Agreement to Collaborate on SDV architecture for ADAS
Hyundai Mobis and Qualcomm Technologies Inc. announced today that the companies have signed a comprehensive agreement an at CES 2026 to co-develop next generation solutions for Software-Defined Vehicle (SDV) and Advanced Driver Assistance Systems (ADAS).
About this update from Qualcomm Incorporated
[{"type":"list","items":[{"val":[{"type":"text","content":"MOU signed at CES 2026 to co-develop integrated solutions for automotive tailored to emerging markets","length":101,"tagName":"p"}]},{"val":[{"type":"text","content":" Hyundai Mobis to enhance performance, efficiency, and stability for advanced driver assistance systems using Qualcomm's Snapdragon RideTM Flex system-on-chip","length":161,"tagName":"p"}]},{"val":[{"type":"text","content":" Companies' agreement extends beyond ADAS development, with plans to deliver broader SDV solutions based on Snapdragon automotive technologies","length":145,"tagName":"p"}]}],"tagName":"ul","bulletedList":true,"length":407,"olType":false},{"type":"text","content":"LAS VEGAS, Jan. 7, 2026 /PRNewswire/ -- Hyundai Mobis and Qualcomm Technologies Inc. announced today that the companies have signed a comprehensive agreement an at CES 2026 to co-develop next generation solutions for Software-Defined Vehicle (SDV) and Advanced Driver Assistance Systems (ADAS).","length":294,"tagName":"p"},{"type":"image","alt":"Hyundai Mobis CI (PRNewsfoto/Hyundai Mobis)","displaySize":"","headline":null,"caption":"Hyundai Mobis CI (PRNewsfoto/Hyundai Mobis)","className":"","disableSlideshowImg":false,"size":{"original":{"width":334,"height":400,"url":"https://media.zenfs.com/en/prnewswire.com/efbed8259e00fad82a5547854c652350"},"resized":{"url":"https://s.yimg.com/ny/api/res/1.2/n.YfV4THVSTK1iNcF.O0Aw--/YXBwaWQ9aGlnaGxhbmRlcjt3PTY0MDtoPTc2NjtjZj13ZWJw/https://media.zenfs.com/en/prnewswire.com/efbed8259e00fad82a5547854c652350","width":334,"height":400}},"href":"https://mma.prnewswire.com/media/1166884/hyundaimobis_CI_Logo.html","hrefExternal":true,"rel":"nofollow"},{"type":"text","content":"The MOU signing, held at the Hyundai Mobis booth on the 7th (PST), was attended by Jung Soo-Kyung, Executive Vice President and head of Automotive Electronics Business Unit, and Mr. Nakul Duggal, EVP and Industrial and Group, General Manager of Automotive, Industrial and Embedded IoT, and Robotics at Qualcomm Technologies Inc. ","length":338,"tagName":"p","attribs":{}},{"type":"text","content":"Through this collaboration, Hyundai Mobis and Qualcomm Technologies will jointly develop integrated solutions tailored for emerging markets while pursuing broader global supply opportunities by leveraging the combination of Hyundai Mobis's ...