Technology
OKI and NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
TOKYO, June 20, 2025--OKI (TOKYO: 6703) , in collaboration with NTT Innovative Devices Corporation (Headquarters: Kanagawa Prefecture; President & CEO: Hidehiro Tsukano; "NTT Innovative Devices" hereinafter), has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) (Note 1) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) (Note 2) onto silicon carbide (SiC) with excell
About this update from Oki Electric Industry Company, Limited
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