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Nordson Electronics Solutions to Demonstrate Plasma Treatment and Automated Fluid Dispensing Systems for Electronics Manufacturing at SEMICON China 2024
Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645 CARLSBAD, Calif.--(BUSINESS WIRE)-- Nordson
About this update from Nordson Corporation
[{"type":"text","content":"\n\nConnect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645\n\n\n\n CARLSBAD, Calif.--(BUSINESS WIRE)--\nNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645.\n\nThis press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240305040124/en/See the semiconductor manufacturing equipment from Nordson Electronics Solutions for plasma treatment and fluid dispensing demonstrated at SEMICON China 2024. The MARCH FlexTRAK®-CD delivers high-throughput plasma processing of strip-type components for semiconductor manufacturing applications, such as leadframe or laminate strips presented in magazines. The ASYMTEK Spectrum® and ASYMTEK Vantage® fluid dispensing systems are designed for semiconductor packaging and assembly to meet the requirements for dispensing underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly during electronics manufacturing. (Photo: Nordson)\nPlasma removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Fluid dispensing provides adhesion, structural integrity, thermal and electrical conductivity, and more in microelectronics manufacturing applications. Equipment in the booth includes:\n\n\n\nThe MARCH FlexTRAK®-CD plasma system delivers high-throughput plasma processing of strip-type components for semiconductor manufacturing applications, such as leadframe or laminate strips presented in magazines. Flexible chamber configurations support contamination removal, etching, and surface activation before die attach, wire bond, molding and encapsulation, and underfill applications.\n\n\n\nThe ASYMTEK Vantage® fluid dispensing system is used for applications in wafer-level packaging and panel-level packaging during semiconductor manufacturing. The Vantage system dispenses precise, fine lines to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly. When configured with dual IntelliJet® valves, using Nordson’s patented jetting technology, Vantage can dispense into gaps less than 200 microns, and up to 90,000 dots per hour.\n\n\n\nExp...