Business

Introducing Automotive-Qualified System-in-Package Hybrid MCU for Automotive and E-Mobility Human-Machine Interface Applications

Microchip’s SAM9X75 hybrid MCU System-in-Package (SiP) enables MPU processing power with the familiar development environment of MCU-based designsCHANDLER, Ariz., March 24, 2026 (GLOBE NEWSWIRE) -- Automotive and E-Mobility designers are incorporating more Human-Machine Interfaces (HMIs) with sophisticated graphics to enhance the user experience. To address the growing demand for HMI solutions, Microchip Technology (Nasdaq: MCHP) today announces the AEC-Q100 Grade 2-qualified, SAM9X75D5M System-

articleMicrochip Technology IncorporatedMarch 24, 20264/company/microchip-technology-inc/news/introducing-automotive-qualified-system-in-package-hybrid-mcu-for-automotive-and-e-mobility-human-machine-interface-applications
Introducing Automotive-Qualified System-in-Package Hybrid MCU for Automotive and E-Mobility Human-Machine Interface Applications

About this update from Microchip Technology Incorporated

[{"type":"image","alt":"Microchip Technology Inc.","displaySize":"","headline":null,"caption":"Microchip Technology Inc.","className":"","disableSlideshowImg":false,"size":{"original":{"width":300,"height":160,"url":"https://media.zenfs.com/en/globenewswire.com/45404978d1a50d8d09f8f2cce3f6dfec"},"resized":{"url":"https://s.yimg.com/ny/api/res/1.2/8bEM2jp6tR9yikQ7hc0oeg--/YXBwaWQ9aGlnaGxhbmRlcjt3PTQyMDtoPTIyNA--/https://media.zenfs.com/en/globenewswire.com/45404978d1a50d8d09f8f2cce3f6dfec","width":300,"height":160}},"lazy":false},{"type":"text","content":"Microchip’s SAM9X75 hybrid MCU System-in-Package (SiP) enables MPU processing power with the familiar development environment of MCU-based designs","length":146,"tagName":"p"},{"type":"text","content":"CHANDLER, Ariz., March 24, 2026 (GLOBE NEWSWIRE) -- Automotive and E-Mobility designers are incorporating more Human-Machine Interfaces (HMIs) with sophisticated graphics to enhance the user experience. To address the growing demand for HMI solutions, Microchip Technology (Nasdaq: MCHP) today announces the AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP) with an Arm926EJ-S™ processor and 512 Mbit DDR2 SDRAM. The SAM9X75D5M supports large display sizes up to 10 inches and XGA resolution of 1024 × 768 pixels.","length":531,"tagName":"p"},{"type":"text","content":"The SAM9X75D5M is part of Microchip’s hybrid MCU family that enables users to capitalize on the advanced processing capabilities of a microprocessor (MPU) with access to embedded, higher memory densities while maintaining the familiar development environment of MCU-based designs, and the option to develop using Real-Time Operating Systems (RTOS). Tailored for automotive applications such as digital cockpit clusters, smart clusters for two- and three-wheelers, HVAC control, EV chargers and more, the SAM9X75D5M hybrid MCU SiP streamlines the development process by combining the MPU and memory into a single package. The device provides ample buffer space for automotive displays and offers flexible display interface options, including MIPI® Display Serial Interface (DSI®), Low Voltage Differential Signaling (LVDS) and RGB data in parallel.","length":847,"tagName":"p"},{"type":"text","content":"With a simplified PCB layout, the SAM9X75D5M can reduce routing complexity and minimize discrete DRAM procurement risk and is built to support l...

More updates from Microchip Technology Incorporated

Microchip TechnologyMPUHuman-Machine InterfacesHMI solutionsReal-Time Operating Systemsmemory densitiesMCUsupportautomotive marketDDR memory