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Marvell to Showcase Industry-leading, End-to-End Connectivity Solutions for AI Data Center Infrastructure at OFC 2026
Over 100 Marvell and Ecosystem Partner Technology Demos and High-profile Executive Presentations Underscore Marvell Position as a Driving Force in Next-gen
About this update from Marvell Technology, Inc.
[{"type":"text","content":"\nOver 100 Marvell and Ecosystem Partner Technology Demos and High-profile Executive Presentations Underscore Marvell Position as a Driving Force in Next-gen AI Infrastructure\n\n\n SANTA CLARA, Calif.--(BUSINESS WIRE)--\nMarvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase the industry’s most comprehensive portfolio of AI data center connectivity solutions at OFC 2026—March 15 to 19 at the Los Angeles Convention Center in Los Angeles, California.\n\n\nAs AI infrastructure scales exponentially, connectivity has become the primary bottleneck of modern hyperscale and cloud data centers, and new, dedicated semiconductor interconnect solutions are required to address the increasing performance, power, design, security and application-specific challenges.\n\n\nWith an unmatched breadth and depth of expertise and a comprehensive connectivity portfolio—including advanced SerDes and die-to-die technology, industry-first DSPs, drivers and TIAs, DCI modules, data center switches and advanced telemetry capabilities—Marvell is uniquely positioned to provide customers with the performance, power efficiency and design flexibility required to keep up with the explosive growth of next-generation AI data centers.\n\n\nAt OFC 2026 (Booth #1600), Marvell will showcase more than 20 demos, highlighting the latest advances in its end-to-end data center connectivity portfolio for scale-up, scale-out and scale-across applications, including:\n\n\n\n40G die-to-die: Marvell 3nm die-to-die (D2D) IP provides the required power-, latency- and error-efficient access needed for on-package D2D connections, including HBM.\n\n\n\nPCIe® 8.0 SerDes: Marvell PCIe 8.0 SerDes running at 256 gigatransfers-per-second (GT/s) enables hyperscalers' transition to next-generation, high-bandwidth and low-latency connections to external resources.\n\n\n\nCXL solutions: Marvell® Structera™ CXL-based near-memory acceleration and memory expansion enables optimal compute and memory scaling to maximize performance and address sustainability.\n\n\n\n1.6T transmit-retimed optics: The Marvell Ara T DSP is the first 8x200G transmit-retimed optics (TRO) PAM4 DSP, offering significant generational performance gains and power savings over fully retimed optics (FRO).\n\n\n\n200G/lambda 1.6T PAM4 optical intercon...