Press release
Marvell to Showcase Interconnect Portfolio for Accelerated Infrastructure at ECOC 2025
Delivering Full-stack Innovation Across Optics, Advanced Silicon and Memory to Power AI Scale-up and Scale-out Data Center Deployments SANTA CLARA, Calif.,
About this update from Marvell Technology, Inc.
[{"type":"text","content":"Delivering Full-stack Innovation Across Optics, Advanced Silicon and Memory to Power AI Scale-up and Scale-out Data Center Deployments \nSANTA CLARA, Calif., Sept. 25, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase its extensive, industry-leading interconnect portfolio for scale-up and scale-out data center AI deployments at the European Conference on Optical Communication (ECOC), September 28 to October 2 in Copenhagen, Denmark.\nThe rapid evolution of generative AI technologies and large-scale models is redefining data center architectures, driving unprecedented demand for interconnect performance, bandwidth and power efficiency. This transformation is accelerating the need for high-performance silicon, advanced memory architectures and tightly integrated optical connectivity. As hyperscalers scale massive AI compute clusters across racks, campuses and multi-site topologies, interconnect technologies must be developed to deliver efficiency, scalability and workload-optimized performance.\nMarvell is addressing this challenge with a full-stack approach—combining advanced silicon platforms, chiplet-based architectures and breakthrough optical technologies. Together, these innovations unlock new levels of performance across scale-up and scale-out fabrics, reduce latency, lower power consumption, and enable faster deployment at cloud scale.\nAt ECOC 2025 (stand #C4134), Marvell will showcase technologies that will drive the next generation of AI interconnects, including:\nCo-packaged Optics (CPO) for AI Scale Up: CPO platform supporting 200G/lane connectivity for energy-efficient, high-bandwidth links spanning multiple racks within an AI scale-up domain.Marvell® COLORZ® 800G ZR/ZR+ for Multi-Site AI Training: Industry-first family of 800 Gbps ZR/ZR+ coherent pluggable optical modules. Supports transmission up to 2,000km, enabling cost-effective, scalable data center interconnect (DCI) between geographically distributed AI clusters.200G/Lambda 1.6T PAM4 Optical Interconnect: Marvell Ara, the industry-first 3nm PAM4 DSP, combines eight 200 Gbps channels inside a single optical module, enabling rapid deployment of AI scale-out fabrics across rows and data halls.Marvell experts will also deliver presentations on interconnect techno...