Business

MACOM Announces Production Availability of 227 Gbps Equalizers Supporting 1.6 Terabit Connectivity

MACOM solutions supporting high-speed copper cabling at 200G per lane to be on display at DesignCon in Booth 802 LOWELL, Mass.--(BUSINESS WIRE)-- MACOM

articleMacom Technology Solutions Holdings, Inc.January 28, 20255/company/macom-technology-solutions-holdings-inc/news/macom-announces-production-availability-of-227-gbps-equalizers-supporting-16-terabit-connectivity
MACOM Announces Production Availability of 227 Gbps Equalizers Supporting 1.6 Terabit Connectivity

About this update from Macom Technology Solutions Holdings, Inc.

[{"type":"text","content":"\nMACOM solutions supporting high-speed copper cabling at 200G per lane to be on display at DesignCon in Booth 802\n\n\n LOWELL, Mass.--(BUSINESS WIRE)--\nMACOM Technology Solutions Inc. (“MACOM”) today announced production availability of its 227 Gbps per lane family of linear equalizers supporting active copper cable (ACC) applications. These innovative devices can help extend the reach of traditional twinax copper Direct Attach Cables (DAC), which become reach limited at 227 Gbps per lane transmission speeds. MACOM’s new linear equalizers can more than double the reach of DAC cables, enabling longer 1.6 Tbps copper cable assemblies for intra-rack connectivity in high-performance computing clusters.\n\n\nMACOM’s linear equalizers employ un-retimed, analog equalization techniques which enable lower power consumption and reduced link latency in short reach applications as compared to retimed copper cable solutions or active electrical cables (AEC). These critical parameters are essential for high density compute cluster applications.\n\n\nThe two MACOM products supporting this solution are MAEQ-40904, a small form-factor die solution, and the MAEQ-40914, a packaged part version. Both devices are designed for small form factor cable connectors, including two channel DSFP, four channel QSFP and eight channel QSFP-DD and OSFP as well as 16 channel OSFP-XD, making them ideal for a wide range of applications. This family of products can also be used in on-board applications to help improve signal integrity and extend trace lengths by providing a signal boost on each channel.\n\n\nThese solutions will be showcased at MACOM’s booth #802 at the upcoming DesignCon in Santa Clara, CA from January 29 to 30, 2025. Visitors can also explore other MACOM products, such as:\n\n\n\nMACOM PURE DRIVE™ 200 Gbps per Lane Linear Drive: MACOM is pushing the boundaries of its MACOM PURE DRIVE portfolio, now supporting 227 Gbps per lane, to facilitate the development of 1.6 T linear pluggable optical (LPO) modules. This technology can eliminate the need for a DSP in optical modules, offering industry-leading low power and low latency solutions. This demonstration will feature optical connectivity solutions, leveraging MACOM’s leading transimpedance amplifiers (TIA) and laser drivers.\n\n\n\nPCIe-over-Fiber: Discover how PCIe technology is being extended...

More updates from Macom Technology Solutions Holdings, Inc.