Press release
Lightwave Logic Provides Fourth Quarter and Fiscal Year 2020 Corporate Update
Company Continues Advancement of Prototypes Towards End-Goal of Mass Commercialization ENGLEWOOD, Colo., April 1, 2021 /PRNewswire/ -- Lightwave Logic, Inc.
About this update from Lightwave Logic, Inc.
[{"type":"text","content":"Company Continues Advancement of Prototypes Towards End-Goal of Mass Commercialization\n\n\nENGLEWOOD, Colo., April 1, 2021 /PRNewswire/ -- Lightwave Logic, Inc. (OTCQX: LWLG), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power, today provided a corporate update in conjunction with the filing of its Annual Report on Form 10-K for the quarter and year ended December 31, 2020.\n\n \n \n \n \n \n \n\n \nRecent Company Highlights: \nAnnounced optimization of the Company's advanced, photo-stable, ultra-high-speed polymer for high-intensity light applications to be trialed with potential customers under NDA for use in telecommunications and data center end-markets. Further developed pre-commercial interactions and relationships with vendors, foundries, and potential customers that align with technology product roadmaps. In particular, these interactions and relationships focus on bringing our Polymer Plus™ product platform to market. More tightly aligned our Polymer Plus™ product platform to telecommunications, data-communications/datacenters, and high-speed computing global and regional markets for commercialization. These markets continue to grow strongly into multi-billion-dollar opportunities that demand high speed, low power consumption, and miniaturization through photonics integration. Fortified intellectual property portfolio through receipt of 9 patent grants over the last 24 months, and 15 published patent applications over the same period. This intellectual property is wide-ranging for polymers and protects key recent technology advancements including: Technology developed by the Company's in-house technical team which allows for the Company's modulators to improve performance across the board, enabling higher reliability in the fiber optics communications environment. A new polymer modulator packaging invention, enabling low-cost and high-volume applications in datacenter and telecommunications markets. Breakthrough in path towards future Chip-on-Board packaged polymer platform with new technique to prevent atmospheric gasses from penetrating optical polymer materials, expected to significantly improve stability and reliability. Continued to build critical pre-commercial awareness at key virtual investor and technology industry events, including...