Press release
Lightwave Logic Announces Issuance of U.S. Patent for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators
Company Secures Patent Issuance for Previously Announced Patent Application for Ability to Fabricate Polymer Modulators Using Chip-Scale Techniques, Enabling
About this update from Lightwave Logic, Inc.
[{"type":"text","content":"Company Secures Patent Issuance for Previously Announced Patent Application for Ability to Fabricate Polymer Modulators Using Chip-Scale Techniques, Enabling Simplified High-Volume Manufacturing through Foundry-Level Packaging \nENGLEWOOD, Colo., Dec. 12, 2022 /PRNewswire/ -- Lightwave Logic, Inc. (NASDAQ: LWLG), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power, today announced the issuance of a U.S. patent, the application of which was announced in June 2022, on a new invention that will enable simplified foundry-level packaging of polymer modulators using chip-scale techniques which can be applied at wafer level, critical for high-volume manufacturing applications.\n\n \n \n \n \n \n \n\n \nThis patent issuance – entitled \"Hybrid electro-optic polymer modulator with atomic layer deposition (ALD) sealant layer\" with patent number US 11,506,918 B2 – allows Lightwave Logic's proprietary polymers to be sealed to moisture and atmospheric gases in a very low temperature and quasi-hermetic environment through the use of a chip-scale packaging approach that can be applied in parallel at wafer level (i.e. in volume) and that eliminates the need for a separate hermetic enclosure or \"gold box.\" Chip-scale packaging is a technique that has been gathering momentum in the silicon electronics industry for the past decade to reduce device chip packaging costs and increase device performance – enabling high-volume front and back-end manufacturing as well as extremely small sizes in miniaturization.\nOver the past two years, Lightwave Logic has developed its atomic layer deposition techniques to not only seal its polymers in a quasi-hermetic environment, but to improve both the stability and reliability of polymer devices, without any adverse effects to poling. The sealant process will enable lower cost system implementation in a high-volume foundry environment. Specifically, Lightwave Logic's electro-optic polymer modulators will be sealed with low-temperature conformal atomic layer deposition dielectric layers that are supported on a silicon substrate with passive silicon photonics waveguides. \nDr. Michael Lebby, Chief Executive Officer of Lightwave Logic, commented: \"With the issuance of this exciting new patent and our recent acquisition of low temperatur...