LG Innotek Launches World's First 'Next-Generation Smart IC Substrate'

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[{"type":"list","items":[{"val":[{"type":"text","content":"Cuts carbon dioxide emissions from its production by 50%—equivalent to planting 1.3 million trees annually.","length":107,"tagName":"p"}]},{"val":[{"type":"text","content":"Boosts durability by up to three times for secure information recognition even with long-term use.","length":98,"tagName":"p"}]},{"val":[{"type":"text","content":"Mass production tailored to global customers starts in November, accelerating customer acquisition.","length":99,"tagName":"p"}]}],"tagName":"ul","bulletedList":true,"length":304,"olType":false},{"type":"text","content":"SEOUL, South Korea, Dec. 22, 2025 /PRNewswire/ -- LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart IC (integrated circuit) Substrate' featuring enhanced performance and reducing carbon emissions generated in its production by half.","length":314,"tagName":"p"},{"type":"text","content":"The smart IC substrate is an essential component for mounting IC chips that store information on smart cards, such as those in credit cards, electronic passports, and USIMs. When users place a smart card in an ATM or on a passport reader, the IC chip's information is transmitted to the device via electronic signals.","length":321,"tagName":"p"},{"type":"list","items":[{"val":[{"type":"text","content":"Carbon emissions from its production cut by 50%, durability boosted by three times, and secure information recognition enabled","length":126,"tagName":"p"}]}],"tagName":"ul","bulletedList":true,"length":126,"olType":false},{"type":"text","content":"This 'Next-Generation Smart IC Substrate' is an eco-friendly product that reduces the carbon emissions generated in its production by half. The product will cut annual carbon dioxide emissions by 8,500 tons—equivalent to planting about 1.3 million trees, the company explained.","length":285,"tagName":"p"},{"type":"text","content":"LG Innotek applied a new material to this product for the first time in the world, achieving high performance without precious metal plating processes.","length":151,"tagName":"p"},{"type":"text","content":"Existing smart IC substrates require plating with precious metals such as palladium and gold (Au) on their surfaces. This process prevents corrosion where the substrate makes contact with readers and ensur...

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