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SK keyfoundry, in Collaboration with LB Semicon, Co-Develops Direct RDL to Advance Semiconductor Packaging and Strengthen Competitiveness in Automotive High-Performance Semiconductors
SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon. This achievement marks a significant step forward in advancing next-generation semiconductor packaging technologies and strengthening the competitiveness of automotive semiconductor products.
About this update from Lb Semicon, Inc.
[{"type":"text","content":"SEOUL, South Korea, July 15, 2025 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon. This achievement marks a significant step forward in advancing next-generation semiconductor packaging technologies and strengthening the competitiveness of automotive semiconductor products.","length":538,"tagName":"p"},{"type":"image","alt":"(PRNewsfoto/Key Foundry)","displaySize":"","headline":null,"caption":"(PRNewsfoto/Key Foundry)","className":"","disableSlideshowImg":false,"size":{"original":{"width":400,"height":137,"url":"https://media.zenfs.com/en/prnewswire.com/4548c0e2c5aa9fc32531f6d6aa1c43f1"},"resized":{"url":"https://s.yimg.com/ny/api/res/1.2/Vu7nY8QoKZkDYqGXl90BIw--/YXBwaWQ9aGlnaGxhbmRlcjt3PTcwNTtoPTI0MTtjZj13ZWJw/https://media.zenfs.com/en/prnewswire.com/4548c0e2c5aa9fc32531f6d6aa1c43f1","width":400,"height":137},"resize_sm":{"url":"https://s.yimg.com/ny/api/res/1.2/WhutLcEZ9.z4Bvse9X9BYg--/YXBwaWQ9aGlnaGxhbmRlcjt3PTY0MDtoPTIxOTtjZj13ZWJw/https://media.zenfs.com/en/prnewswire.com/4548c0e2c5aa9fc32531f6d6aa1c43f1","width":400,"height":137}},"href":"https://mma.prnewswire.com/media/2305961/Logo.html","hrefExternal":true,"rel":"nofollow"},{"type":"text","content":"RDL refers to metal wiring and insulating layers on top of semiconductor chips to enable electrical connections. It is primarily used in WLP (Wafer Level Packaging) and FOWLP (Fan-Out Wafer Level Packaging) processes to enhance connectivity between the chip and the substrate while minimizing signal interference. The newly co-developed Direct RDL by SK keyfoundry and LB Semicon supports power semiconductors with high current capacity, outperforming competitors. The technology achieves a metal wiring thickness of up to 15 μm and wiring density covering up to 70% of the chip area – making it suitable not only for mobile and industrial applications but also for automotive use. In particular, the solution meets the Auto Grade 1 classification under AEC-Q100 international automotive semiconductor quality standard, ensuring reliable operation in harsh environments with an operating temperature range of –40℃ to +125℃....