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Laser Photonics Expands Semiconductor Industry-Focused Product Line
ORLANDO, Fla.--(BUSINESS WIRE)-- Laser Photonics Corporation (NASDAQ: LASE) (“LPC” or “the Company”), a leading global developer of industrial laser systems
About this update from Laser Photonics Corporation
[{"type":"text","content":" ORLANDO, Fla.--(BUSINESS WIRE)--\nLaser Photonics Corporation (NASDAQ: LASE) (“LPC” or “the Company”), a leading global developer of industrial laser systems for cleaning and other material processing applications, announced today the expansion of its product offering targeting the surging market for chip fabrication.\n\n\nThe growing demand for electronics and electric vehicles, the rise of industrial automation, and the adoption of AI by technologies across all areas are just some factors that are propelling the chip design and fabrication market forward. Indeed, some analysts expect the semiconductor market to reach an annual $1 trillion by 2030 on the global scale. Yet, although global supply chains have largely recovered from the COVID-19 pandemic, challenges persist as they struggle to fulfill the high demand for advanced chips. That is why the adoption of high-speed laser processing equipment by chip fabs is more essential than ever.\n\n\nLPC is providing this laser-powered technology to help accelerate the manufacturing of semiconductors. For the Company, established as a trusted provider of industrial laser equipment for surface preparation, cutting, marking, and welding, chip fabrication has been one of the target sectors. Now, joined by its recently acquired subsidiary, Control Micro Systems, Inc. (CMS), LPC has expanded its product line of advanced laser wafer dicing, marking, and scribing technologies.\n\n\nOne of LPC’s flagship products in this space is the BlackStar laser wafer dicing and scribing system. Engineered with short-pulse laser technology, die singulation by the BlackStar involves minimal heat and does not require water jet cooling to separate brittle materials like silicon. This technique greatly improves die yield while minimizing the need for individual die processing, in turn reducing time and labor.\n\n\nLPC’s expanded portfolio of products for the semiconductor industry now also includes custom-tailored multi-station laser systems for wafer marking, scribing, and lapping, built to handle a variety of wafer thicknesses and sizes. This innovative technology features robotic wafer positioning and machine vision, and serves to facilitate the production and tracing of chips. Separately, a chip marking system integrating ultraviolet laser technology has been added to its portfolio, which allows for the...